Multilayer Wiring Substrate Metal Core for High Current
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Solution Overview
Problem
Existing electrical connecting apparatuses, such as probe cards, struggle to handle high current demands due to limitations in wiring resistance and the need for thin, high-density substrates, which complicates the integration of busbars and efficient power supply paths.
Innovation Solution
The proposed electrical connecting apparatus features a multilayer wiring substrate with a metal core member positioned near power supply and ground terminals, allowing for efficient current transmission and reduced wiring resistance by forming short power supply and ground paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If busbars are attached to the substrate to pass large current, then current carrying capacity is improved, but substrate thickness increases and layout flexibility is reduced
Solution Approach 1:
The patent embeds the metal core member (busbar) inside the multilayer wiring substrate, nesting the current-carrying element within the substrate structure itself. This allows the busbar to be integrated into the substrate without increasing overall substrate thickness, as the metal core is contained within the existing substrate layers rather than being attached externally.
Solution Approach 2:
The patent transitions from external attachment (2D surface mounting) to internal embedding (3D integration) of the metal core member. By placing the busbar within the substrate's internal structure rather than on its surface, the design achieves high current carrying capacity without increasing the substrate's external dimensions or compromising layout flexibility.
2Loss of energy
If through-holes are filled with copper to reduce wiring resistance, then wiring resistance is reduced, but current carrying capacity for high-power applications (exceeding 1000 A) is insufficient
Solution Approach 1:
The patent applies different structural solutions to different parts of the substrate: standard copper-filled through-holes for general wiring resistance reduction, and a dedicated embedded metal core member specifically for high-current power supply paths. This localized approach optimizes each region for its specific function, with the metal core providing exceptional current carrying capacity where needed while maintaining standard construction elsewhere.
Solution Approach 2:
The patent combines multiple conductive materials and structures: copper-filled through-holes for general connectivity and an embedded metal core member (such as copper or copper alloy) for high-current paths. This composite approach leverages the advantages of both methods, achieving both low wiring resistance and high current carrying capacity exceeding 1000 A.
3Quantity of substance
If the substrate is made thin to achieve high wiring density, then wiring density is improved, but heat dissipation capability deteriorates due to Joule heat
Solution Approach 1:
The embedded metal core member acts as a thermal intermediary, providing an internal heat conduction pathway within the thin substrate. The high thermal conductivity of the metal core enables efficient heat dissipation from high-current regions, compensating for the reduced heat dissipation capacity inherent in thin substrate designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the apparatus to handle large amounts of current while maintaining a thin, high-density substrate, effectively reducing wiring resistance and supporting high-power applications such as AI processing semiconductor tests.
Implementation Method 1
the metal core member is arranged at a position where one or both of a power supply terminal and a ground terminal of the electrode terminals of the test subject are present
Implementation Method 2
since heat is generated by Joule heat, if measures are insufficient, the product will be destroyed
Data Source
AI summary
A large amount of current can be allowed, many short power supply paths and ground paths can be formed, and a wiring resistance can be significantly reduced.An electrical connecting apparatus that electrically connects a testing device and a test subject includes a multilayer wiring substrate having a plurality of contactors that electrically contact electrode terminals of the test subject and electrically connect substrate electrodes connected to the testing device and the electrode terminals, in which the multilayer wiring substrate has a metal core member, and the metal core member is arranged at a position where one or both of a power supply terminal and a ground terminal of the electrode terminals of the test subject are present.