Semiconductor Probe Card for Mounting Environment Inspection
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Solution Overview
Problem
Current substrate inspection apparatuses, such as probers, are unable to effectively inspect the electrical characteristics of packaged semiconductor devices in a mounting environment due to the absence of electrode pads and solder bumps, leading to undetected defects and malfunctions after packaging.
Innovation Solution
A substrate inspection apparatus comprising a probe card with probes that contact semiconductor devices on a substrate, a test box with an inspection board replicating a motherboard circuit, and a package inspection card with another inspection board, allowing for the reproduction of a mounting environment for both wafer-level system-level testing and packaged device inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a probe card is used to inspect semiconductor devices on a wafer, then electrical characteristics can be measured, but the inspection cannot be performed on packaged devices in a mounting environment
Solution Approach 1:
The probe card is designed to serve multiple functions: it can inspect both semiconductor devices on wafers and packaged devices in mounting environments. The card includes probes for contacting device electrodes and inspection circuits that can operate in both wafer-level and post-packaging inspection scenarios, eliminating the need for separate inspection equipment.
Solution Approach 2:
The probe card acts as an intermediary between the inspection system and the packaged device. It includes inspection circuits that interface with the device under test through the probes, enabling electrical characteristic measurement in the mounting environment without requiring direct connection to the packaged device's external terminals.
2Reliability
If wafer-level system-level test is performed to guarantee quality, then defects can be detected early, but packaged devices may still malfunction after packaging
Solution Approach 1:
The system performs preliminary inspection of packaged devices in the mounting environment before final assembly or deployment. By using the probe card to conduct inspections after packaging, potential defects are detected early in the production flow, preventing faulty devices from reaching the market.
Solution Approach 2:
The inspection system provides feedback on the electrical characteristics of packaged devices in the mounting environment. This feedback mechanism allows for identification of defects that may have been introduced during packaging or assembly, enabling corrective actions to be taken before the devices are deployed.
3Ease of operation
If IC tester with different circuit configuration is used, then inspection can be performed, but the mounting environment cannot be reproduced
Solution Approach 1:
The probe card includes inspection circuits with configurable parameters that can be adjusted to match different mounting environments. By changing circuit configuration parameters rather than requiring completely different hardware, the system can accurately reproduce various mounting conditions while maintaining ease of operation.
Data Source
AI summary
There is provided a substrate inspection apparatus capable of inspecting the electrical characteristics of a packaged semiconductor device in a mounting environment. A prober includes a test box, a probe card and a package inspection card. A packaged device is attached to the package inspection card. A test board of the test box and a card board of the package inspection card reproduce the mounting environment in which a wafer-level system-level test is performed.