Semiconductor Probe Card Signal Trace Isolation
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Solution Overview
Problem
Conventional probing apparatuses for semiconductor devices experience signal loss and disturbance due to the spanning of probes across power and signal contact areas, leading to increased internal trace lengths and proximity of signal traces to power contacts.
Innovation Solution
The use of a primary circuit board with separate areas for power and signal contacts, where the signal probe connects signal contacts without spanning the power board area, allowing for linear signal traces and reducing signal disturbance by isolating power and signal conductive through holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If probes span across power ring area to connect signal contacts, then electrical connection is achieved, but signal loss increases due to increased probe length
Solution Approach 1:
The probe card is divided into distinct functional zones: power ring area, signal ring area, and inner area. Probes are segmented into power probes (spanning power ring area) and signal probes (connecting signal contacts without spanning power area). This spatial segmentation allows signal probes to remain short and linear, avoiding signal loss while maintaining electrical connection reliability.
2Reliability
If internal traces bypass power contacts to connect signal contacts, then electrical connection is achieved, but signal disturbance increases due to proximity to power contacts
Solution Approach 1:
The harmful power contacts are extracted from the signal transmission path. Power contacts are isolated in the power ring area, while signal contacts are positioned in the signal ring area and inner area. Internal traces for signal transmission are routed to bypass the power contact area entirely, eliminating electromagnetic interference and signal disturbance.
Solution Approach 2:
Different regions of the probe card are assigned different functional qualities: the power ring area handles power distribution, the signal ring area handles signal input, and the inner area handles signal processing. This local functional differentiation ensures that signal traces remain away from power contacts, reducing signal disturbance while maintaining reliable electrical connections.
Data Source
AI summary
A probing apparatus for semiconductor devices provides a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.