Heating Device on Lifting Stage for Semiconductor Probing
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Solution Overview
Problem
Conventional probing apparatuses for testing semiconductor chips, such as LED chips, face issues with electric wire breakage and poor electrical contacts due to complex wire arrangements and slip rings, which are prone to failure over time.
Innovation Solution
A probing apparatus design where the heating device is mounted on a lifting stage that moves independently of the rotating device, allowing direct contact with platforms and eliminating the need for slip rings and complex wire arrangements, thus preventing wire breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heating device is mounted on the rotating device with slip rings for electricity transmission, then the heaters can be fixed relative to the platforms and heat the DUTs to desired temperature, but the electric wires tend to break or bad electrical contacts may happen after long period of working time
Solution Approach 1:
The heating device is extracted from the rotating device and mounted on the stationary lifting stage instead. This removes the need for slip rings and rotating wire connections, eliminating the source of electrical contact problems while maintaining the heating function through periodic contact with platforms at the test position
Solution Approach 2:
The lifting stage acts as an intermediary carrier for the heating device, enabling it to move vertically to contact platforms at the test position without requiring rotational movement or flexible wire connections. This intermediary structure decouples the heating function from the rotating mechanism
2Productivity
If the heating device revolves along with the rotating device, then the heaters can heat multiple platforms sequentially, but the electric wires and slip rings are prone to failure over time
Solution Approach 1:
The heating device performs periodic heating actions by moving vertically with the lifting stage to contact each platform at the test position in sequence, rather than continuously revolving. This periodic contact mechanism maintains testing throughput while eliminating continuous wire rotation and slip ring wear
Solution Approach 2:
The lifting stage moves the heating device to the test position in advance before each heating operation, ensuring the heating device is positioned correctly and ready to contact the platform. This preliminary positioning enables efficient sequential heating without requiring complex rotating wire arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable heating and testing of semiconductor chips without wire breakage and complex electrical connections, enabling continuous operation and improved reliability.
Implementation Method 1
The heating device is provided with a plurality of electrical heaters attached to the platforms
Implementation Method 2
a thermal sensor fixed relative to the lifting stage for sensing the temperature of the platform at the test position or the temperature of the DUT supported on the platform at the test position
Data Source
AI summary
A probing apparatus includes a rotating device having a plurality of platforms for supporting DUTs, a probe device having a lifting stage movable between first and second positions, and a heating device mounted to the lifting stage so as to move along with it. The platforms are synchronously revolvable in a way that the platforms move to a test position sequentially The heating device is configured in a manner that when the lifting stage moves to the first position, the heating device is located away from the platform at the test position, and when the lifting stage moves to the second position, the heating device contacts and heats the platform at the test position. Therefore, the heating device and the probe device are movable simultaneously for heating up the platform and testing the DUT respectively.