Thermal Head Independent Zone Control
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Solution Overview
Problem
Current test systems fail to independently control the temperature and force of multiple components within close proximity in advanced IC packages, leading to thermal management challenges due to differing power dissipation and structural complexities.
Innovation Solution
A thermal head system comprising multiple adapters, heaters, and thermal controllers that allow independent temperature and force control of components, using heaters and cold plates to maintain specific set point temperatures and applying forces through mechanisms like pneumatic or hydraulic systems, ensuring precise thermal and mechanical control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single thermal control system is used for multiple components, then device complexity is reduced, but temperature control precision for individual components deteriorates
Solution Approach 1:
The thermal control system is segmented into multiple independent thermal control zones, each with its own heater and thermal controller. This allows each component to be controlled independently while maintaining overall system functionality, resolving the contradiction between system simplicity and control precision.
Solution Approach 2:
Different regions of the device are assigned different thermal control characteristics through localized heaters and controllers. Each zone can be optimized for its specific component's thermal requirements, enabling precise temperature control without requiring a completely complex system architecture.
2Productivity
If components are placed in close proximity to increase integration density, then productivity is improved, but thermal management capability deteriorates
Solution Approach 1:
The device is divided into multiple thermally independent zones with individual heaters and controllers, allowing high-density component placement while maintaining separate thermal control for each component, thus preserving thermal management capability despite increased integration density.
Solution Approach 2:
The system dynamically adjusts thermal parameters (heating power, cooling rate) for each zone based on real-time temperature feedback and component power dissipation characteristics, enabling effective thermal management in high-density configurations.
3Device complexity
If force is applied uniformly to all components, then device complexity is reduced, but thermal coupling efficiency deteriorates
Solution Approach 1:
The force application mechanism is configured to apply different forces to different components based on their individual thermal and mechanical requirements. This localized force application optimizes thermal coupling efficiency for each component without requiring a completely complex multi-mechanism system.
Solution Approach 2:
The system dynamically adjusts the force parameter for each component based on real-time temperature feedback and thermal coupling requirements, enabling efficient thermal management while maintaining relatively simple mechanical actuation mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous and precise thermal management of multiple components with different power dissipation rates and structural configurations, maintaining set point temperatures and applying appropriate forces, thereby improving testing accuracy and reliability.
Implementation Method 1
one or more heaters thermally coupled to the plurality of adapters and the one or more components
Implementation Method 2
one or more cold plates thermally coupled to the plurality of adapters
Data Source
AI summary
Disclosed herein are thermal heads and corresponding test systems for independently controlling a one or more components while testing one or more devices under test. In some embodiments, a thermal head comprises a plurality of adapters, one or more heaters, and one or more thermal controllers for independently controlling temperatures of the components. The thermal controllers may control the temperatures of at least some of the components independently such that thermal control of one component does not affect the thermal control of the other component. In some embodiments, the thermal control is by way of one or more cold plates, and the thermal head comprises one or more cold plates. Embodiments of the disclosure further include independent control of one or more forces using one or more force mechanisms.