Reversible Probe Pin Wear Distribution for Semiconductor Testing

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Solution Overview

Problem

The frequent replacement of worn probe pins during semiconductor device testing increases manufacturing costs due to wear from repeated contact with external terminals, affecting the reliability of electrical tests.

Innovation Solution

A test apparatus with a probe pin configuration where two tip portions, initially contacting the semiconductor device and the test board, are designed to alternate contact positions after wear, extending the probe pin's lifespan by maintaining consistent contact resistance and reducing wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a probe pin is repeatedly used for electrical testing by contacting external terminals, then the probe pin wears away, but frequent replacement increases manufacturing cost

Engineering Contradiction:

Improveelectrical test reliabilityVSAvoidprobe pin lifespan

Core Design Contradiction:

ReliabilityVSDuration of action of moving object

Solution Approach 1:

The probe pin is divided into two separate tip portions (first tip portion and second tip portion) at its ends. Each tip portion contacts a different surface (first external terminal on one side, second external terminal on the other side), allowing independent wear and replacement of each tip while retaining the entire probe pin structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of replacing the entire probe pin when one tip wears, the invention inverts the approach by making the tips reversible and interchangeable. The probe pin can be rotated 180 degrees to use the opposite tip, effectively doubling the probe pin's service life and reducing replacement frequency.

Inventive Principle:

Principle #13The other way round (Inversion)

2Duration of action of moving object

If the probe pin structure is made complex with two different tip portions, then wear can be distributed, but device complexity increases

Engineering Contradiction:

Improveprobe pin lifespanVSAvoidprobe pin structure

Core Design Contradiction:

Duration of action of moving objectVSDevice complexity

Solution Approach 1:

The probe pin employs asymmetric design where the two tip portions are positioned at opposite ends of the pin, creating a symmetric overall structure that simplifies manufacturing while enabling functional asymmetry in wear distribution. Each end can be independently optimized for its specific contact surface.

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS11860225B2Method of manufacturing semiconductor device

Publication Date: 2024.01.02 RENESAS ELECTRONICS CORP

AI summary

A test apparatus includes a test board, a unit, and a probe pin housed in the unit. First and second tip portions of the probe pin have the same shape as each other. A first external terminal of a first semiconductor package is brought into contact with the first tip portion of the probe pin and the second tip portion thereof is brought into contact with the terminal of the test board, thereby performing an electrical test of the first semiconductor package. Then, the unit is turned upside down and rearranged in the test apparatus. Thereafter, a second external terminal of a second semiconductor package is brought into contact with the second tip portion of the probe pin and the first tip portion thereof is brought into contact with the terminal of the test board, thereby performing an electrical test of the second semiconductor package.