Interleaved Test Electrodes for Semiconductor Area Utilization
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Solution Overview
Problem
Semiconductor manufacturing processes face challenges in maximizing the number of test structures and pads per unit area within scribe lines due to limited space and the need to comply with probe card test requirements, leading to inefficiencies in area utilization and potential sacrifice of valuable chip area.
Innovation Solution
A semiconductor structure with multiple sets of test electrodes spaced according to a predetermined pitch, allowing for increased density and efficient placement of test structures without altering the probe card's test requirements, by interleaving electrodes to maximize area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If test electrodes are arranged in a conventional grid pattern to match probe card pitch, then probe card compatibility is maintained, but area utilization efficiency deteriorates due to excessive spacing between electrodes
Solution Approach 1:
The patent transitions from a conventional two-dimensional grid arrangement to a multi-layer three-dimensional arrangement where test electrodes are distributed across multiple levels. This vertical dimensionality change allows electrodes to be positioned closer together in the planar view while maintaining proper spacing through layer separation, thereby improving area utilization without compromising probe card compatibility
Solution Approach 2:
The patent implements a nested structure where test electrodes on upper layers are positioned within the vertical projection area of electrodes or inter-electrode regions on lower layers. This nesting approach allows multiple electrode sets to occupy overlapping footprint areas, significantly increasing the density of test structures per unit area while preserving the required pitch for probe card interfacing
2Quantity of substance
If more test structures are placed within scribe lines, then process monitoring capability is improved, but available space for production chips deteriorates
Solution Approach 1:
By utilizing the vertical dimension through multiple electrode layers, the patent increases the capacity to accommodate test structures within the same planar footprint. This allows more test structures to be integrated into scribe line areas without expanding the lateral space required, thereby preserving more area for production chips
Solution Approach 2:
The patent segments the test electrode system into multiple independent layers, each capable of being tested separately. This segmentation allows test structures to be distributed across layers rather than competing for the same planar space, enabling higher density placement of test structures within constrained scribe line regions
3Area of stationary object
If test electrode density is increased to maximize scribe line utilization, then area efficiency is improved, but probe card test requirements may be compromised
Solution Approach 1:
The multi-layer arrangement resolves this contradiction by providing additional vertical space for electrode placement. This allows the planar pitch between electrodes to be maintained at probe card-compatible dimensions while increasing overall electrode density through layer multiplication, thus improving area efficiency without compromising test requirements
Solution Approach 2:
The nested positioning of electrodes across layers allows dense packing within the vertical projection area while maintaining adequate spacing between electrodes on the same layer. This ensures probe card compatibility is preserved for each layer's electrodes while achieving high overall density through the nested multi-layer configuration
Data Source
AI summary
A semiconductor structure (100; 200) is provided. The semiconductor structure (100; 200) comprises a substrate (5); a plurality of test structures (101, 102, 201, 202) on the substrate, wherein the plurality of test structures comprise a first set of test structures (101, 102) and a second set of test structures (201, 202); a plurality of test electrodes (10, 20, 30) provided on the substrate, wherein the test electrodes comprise a first set of electrodes (10) operatively connected to the first set of test structures (101, 102), and a second set of electrodes (20) operatively connected to the second set of test structures (201, 202), wherein the first set of electrodes (10) are spaced apart from one another by a predetermined pitch and are configured to be operatively connectable to a probe card (8) having a plurality of probe pins (7) spaced apart from one another by the predetermined pitch to test the first set of test structures, and wherein the second set of electrodes (20) are spaced apart from one another by the predetermined pitch and are configured to be operatively connectable to the probe card (8) to test the second set of test structures; and wherein at least one electrode within the second set of electrodes (20) is disposed between adjacent electrodes within the first set of electrodes (10) along a length of the first set of electrodes (V).