Electronic Component Testing Device Thermal Runaway Control
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Solution Overview
Problem
Existing electronic component testing devices struggle to accurately detect and control the temperature of self-heating components due to thermal runaway issues, caused by the diffusion of heat and inefficient heat management systems, leading to inaccurate temperature readings and potential device failure.
Innovation Solution
An electronic component testing device with a first conduction terminal equipped with a temperature sensor and a second conduction terminal that includes a heater, capable of releasing more heat than the self-heating component, along with a control unit for precise temperature feedback, and optionally an auxiliary heater to prevent heat loss, allowing for efficient temperature regulation and prevention of thermal runaway.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor with a heat conduction block is used to detect the temperature of the electronic component, then the temperature detection structure is established, but the heat conduction block's large heat capacity causes heat diffusion that lowers the detected temperature reading accuracy
Solution Approach 1:
The patent extracts the heat conduction block from the temperature sensor assembly and makes it a separate, removable component. This allows the temperature sensor to detect temperature without the interfering heat capacity of the block, while the block remains available for thermal coupling when needed. The block is taken out of the direct measurement path to eliminate its negative effect on accuracy.
Solution Approach 2:
The heat conduction block serves as an intermediary element that can be selectively positioned between the electronic component and the temperature sensor. When removed, it eliminates heat diffusion interference. When present, it provides thermal coupling. This intermediary approach allows flexible control over the measurement accuracy versus thermal coupling trade-off.
2Reliability
If feedback control is used to manage self-heating electronic components, then temperature regulation is implemented, but thermal runaway occurs because the control system cannot catch up with rapid self-heating
Solution Approach 1:
The patent applies preliminary cooling action by positioning the temperature sensor very close to the electronic component's heat-generating region. This allows the control system to detect temperature rises earlier and apply cooling before thermal runaway occurs. The system takes preliminary measurements that enable proactive rather than reactive control.
Solution Approach 2:
The patent implements a feedback control system where the temperature sensor continuously monitors the electronic component's temperature and feeds this information back to the control mechanism. This closed-loop feedback enables dynamic adjustment of cooling to match the component's self-heating rate, preventing thermal runaway by responding rapidly to temperature changes.
3Temperature
If a cooling system with heat absorber and heat radiator is used, then temperature control capability is provided, but the system cannot accurately detect the electronic component's temperature due to heat diffusion
Solution Approach 1:
The patent segments the temperature control system into distinct functional components: a cooling system with heat absorber and heat radiator, and a separate temperature detection system. The temperature sensor is positioned to detect temperature without being part of the heat transfer path, eliminating the heat diffusion problem while maintaining cooling capability.
Solution Approach 2:
The patent introduces an intermediary heat conduction block that mediates between the electronic component and the temperature sensor. This block can be positioned to provide thermal coupling for accurate detection while the sensor itself remains thermally isolated from the component's self-heating effects, resolving the conflict between cooling capability and measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively maintains the self-heating electronic component at a predetermined temperature, enhancing temperature feedback responsiveness and preventing thermal runaway, thus ensuring accurate testing and reliable temperature control.
Implementation Method 1
a temperature sensor of the first conduction terminal, for measuring the temperature of the electronic component
Implementation Method 2
a second conduction terminal that includes a heater for heating the electronic component to the test temperature
Implementation Method 3
having the ability to release a larger amount of heat than the amount of heat generated by self-heating of the electronic component
Implementation Method 4
a control unit for feeding back the temperature of the electronic component detected by the temperature sensor to the heater, and controlling the heater so that the temperature of the electronic component is kept at a predetermined temperature
Implementation Method 5
self-heating by electrical conduction increases the temperature
Data Source
AI summary
An electronic component testing device which is able to release heat (radiate heat) efficiently from a self-heating electronic component, and is able to carry out an intended test efficiently while keeping the temperature of the electronic component within a predetermined range higher than ordinary temperature.