Surface-Mount Blocking Elements in BGA Packages
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Solution Overview
Problem
Existing integrated circuit packages, such as Ball Grid Array (BGA) packages, are vulnerable to unauthorized access as thieves or hackers can physically penetrate and access inner signal bond balls using thin magnet wires, despite anti-tamper security measures.
Innovation Solution
Incorporating surface-mount blocking elements, such as passive or active discrete components like resistors or capacitors, between the rows of outer mesh bond balls and inner signal bond balls, creating a physical barrier that prevents wire insertion and enhances security by making it difficult for attackers to access sensitive data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If outer mesh bond balls are used to enclose inner signal bond balls, then security against unauthorized access is improved, but attackers can still penetrate using thin magnet wires
Solution Approach 1:
A surface-mount blocking element is introduced as an intermediary component between the outer mesh bond balls and inner signal bond balls. This blocking element acts as a mediator that prevents direct wire penetration while maintaining the overall BGA package structure and functionality.
Solution Approach 2:
The security barrier is segmented into multiple components: outer mesh bond balls, surface-mount blocking elements, and inner signal bond balls. This segmentation creates layered protection where each element serves a specific security function, making wire penetration significantly more difficult.
2Volume of moving object
If distance between outer mesh bond balls and inner signal bond balls is reduced, then package size is minimized, but security barrier effectiveness is weakened
Solution Approach 1:
The security barrier is extended into the vertical dimension by placing surface-mount blocking elements between the outer mesh bond balls and inner signal bond balls. This dimensional addition provides effective security protection without significantly increasing the horizontal package footprint.
Solution Approach 2:
The surface-mount blocking elements are strategically positioned only where needed - between the outer mesh bond balls and inner signal bond balls. This localized placement provides enhanced security at critical points while minimizing overall package size and maintaining compact design.
3Object-affected harmful factors
If surface-mount blocking elements are added, then physical barrier against wire probing is improved, but device complexity increases
Solution Approach 1:
The surface-mount blocking elements serve multiple functions: they act as physical barriers against wire insertion, maintain structural integrity of the BGA package, and can be integrated with existing manufacturing processes. This multi-functionality justifies the added complexity by providing comprehensive security protection.
Data Source
AI summary
A first cavity-down ball grid array (BGA) package includes a substrate member and an array of bond balls. The array of bond balls includes a pair of parallel extending rows of outer mesh bond balls and a row of inner signal bond balls that is parallel to the pair of rows of outer mesh bond balls. A surface-mount blocking element is disposed between the row of inner signal bond balls and the pair of rows of outer mesh bond balls. The surface-mount blocking element is either a passive or an active component of the BGA package. In one example, the first cavity-down BGA package is surface-mounted to a second cavity-down BGA package to form a package-on-package (POP) security module. The surface-mount blocking element provides additional physical barrier against the probing of the inner signal bond balls. Sensitive data is therefore protected from unauthorized access.