Printed Circuit Assembling TRIZ Cases

A circuit board manufacturing method uses half-etching to form microcircuits without plating.

Adhesion promoter layer strengthens lacquer-to-adhesive bonding, reducing connection failure under mechanical stress.

A wiring substrate with a raised nickel layer reduces intermetallic compound brittleness, preventing solder ball detachment under external stress.

A sensor device uses a molded PCB substrate with an integrated media channel to route fluid through the package body.

Absorbing member stabilizes conveying chains between frames in automatic soldering apparatuses.

Deformed conductive layer indentations eliminate laser-drilled vias, resolving void clusters and leakage inductance while improving thermal dissipation.

An asymmetric trapezoidal alignment mark reduces light scattering from edges to enhance detection accuracy while maintaining mechanical strength.

A flexible suspension subassembly cushions a display screen against mechanical shock, reducing damage risk while maintaining structural stability.

A metallurgical joint between copper connection portions uses reduced oxide films to form a direct bond without tin alloy layers.

Segmented mold design exposes chip backside markings for readability while the molding region protects the semiconductor device sides.

Ridges and grooves formed by profile grinding increase sealing layer surface area, improving heat dissipation without adding processing steps.

Bent flexible substrate peripheral units overlap to connect signal lines directly, eliminating bezel area constraints.

A camera assembly integrates photosensitive chips and functional components via a redistribution layer structure within an encapsulation layer.

A flexible insulating membrane forms a bulge to encase components, resolving paint detachment and glob top stress issues in high-voltage environments.

A tapered through-hole structure increases inner surface area to enhance metal plating adhesion on thin insulating layers.

Surface-mount blocking elements create a physical barrier between outer mesh and inner signal bond balls, preventing wire penetration probing attacks.

Selective plating on the microphone housing prevents solder creep while reducing manufacturing costs.

Segmented sleeve and roller design simplifies assembly complexity while enabling standardized integration with Surface Mount Technology processes.

Protrusions and recesses on actuator contacts confine conductive adhesive particles to prevent electrical shorts.

Transistors selectively couple conductive paths to supply nodes, eliminating boundary scan overhead and reducing device area.

A touch panel junction structure uses insulating spacer columns between unit bonding pads to maintain uniform adhesive layer thickness during flexible printed circuit board attachment.

A pedestal portion of first underfill resin supports a second underfill resin layer to cover the side face of a larger stacked semiconductor chip.

A component mounting device adjusts suction nozzle holding positions based on functional unit recognition to ensure precise substrate placement.

An elastic core bonded via a conductive adhesive layer maintains conductivity during high-temperature reflow soldering.

A Z-directed component uses a removable tapered end portion to facilitate insertion into printed circuit board mounting holes.

A substrate standby unit stores identification information and updates it during transfer to component installation devices.

A board connector housing links supporting walls to a terminal holding wall via a reinforcing portion to enhance structural rigidity.

Selective thermally conductive members adapt to electronic components, reducing thermal resistance in compact circuit card assemblies.

Segmented conveyance mechanisms with a rod-based switching system maintain hermetic sealing while reducing maintenance frequency.

Coupling recesses and solder dams restrict gull-wing lead movements, raising the natural resonant frequency above 45 kHz for automotive airbag sensors.

A rigid carrier supports electrodeposited copper coating during processing to enable precise conductor pattern definition.

A screen printing machine with a movable main body creates rear maintenance space.

Stud bumps absorb thermal energy and distribute heat during ultrasonic bonding, preventing damage to biocompatible materials.

Direct connector links adjacent flexible wiring plates, eliminating intermediate connection plates to reduce manufacturing complexity and cost.

A circuit board with a low refractive index portion surrounding a transmissive portion reflects signal light toward a light-receiving element.

A panel carrier uses anisotropic conductive adhesive to electrically connect LCOS bond pads and conductive layers to a printed circuit assembly.

Segmented light-shielding films create viewing windows for terminal inspection, resolving black matrix obstruction issues.

Segmented multilayer capacitor regions with dummy electrodes reduce high frequency noise and EMI by increasing parasitic inductance.

A multilayer ceramic capacitor uses color-coded glazes to identify laminating direction and ensure consistent internal electrode orientation.

A printed wiring board design uses asymmetric metal bumps to maintain uniform protruding heights across conductor pads of varying diameters.

An automated system replaces manual screening with rule-based selection, reducing production batches and eliminating staff-dependent errors.

Varying conductive ball diameters in anisotropic films attach driving ICs to display substrates, preventing warpage and signal transmission errors.

Integrated circuits on a flexible printed circuit measure battery cell voltage and temperature via direct contact elements.

An asymmetric conductive through hole design with elastic micro terminals prevents deformation during repeated insertion, ensuring reliable data transfer.

Segmented solder resist covers connection electrode edges while a receiving portion traps excess bonding material to prevent chip-side ball formation.

Photo-sensors detect abnormal substrates to prevent particle contamination and oxidation during automated handling.

A substrate with recessed electrode lands reduces stray capacitance while maintaining bonding strength.

Sintered organometallic paste forms conductive columns between stacked wiring substrates.

A component height sensing system measures relative heights of tooling pins using a height sensor and control means to identify deviations.