Ultra-thin Copper Conductor Structure on Rigid Carrier
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Solution Overview
Problem
Existing methods for producing conductor structure elements face challenges in creating extremely thin and fine conductive patterns without bending issues during processing, and in efficiently separating conductive patterns from temporary carriers without damaging the copper coating.
Innovation Solution
A method involving a rigid carrier with a thin copper coating, where the copper is electrodeposited and a conductive pattern is applied, followed by insulation and detachment of the carrier using chemical, physical, or mechanical means, allowing for precise processing and assembly without bending, and subsequent etching to expose the conductive pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin copper layer is electrodeposited on a temporary carrier and processed, then extremely thin and fine conductive pattern structures can be produced, but the layer structure is prone to bending during processing
Solution Approach 1:
The patent segments the processing into two distinct phases: first processing the conductor structure element while it is firmly connected to the rigid carrier (providing stability), then detaching the carrier to leave the thin conductive pattern structure (achieving thinness). This segmentation allows each phase to optimize for its specific requirement without compromise.
Solution Approach 2:
The rigid carrier serves as an intermediary object that provides mechanical stability during processing. It is temporarily introduced to support the thin copper layer during manufacturing operations, then removed after serving its purpose. The carrier enables processing of thin structures by providing the necessary structural support during the manufacturing phase.
2Manufacturing precision
If the rigid carrier is detached to expose the conductive pattern structure, then the desired thin conductive element is obtained, but the copper coating may be damaged or attacked
Solution Approach 1:
The patent converts the potential harm of chemical etching into a beneficial selective removal process. By choosing a rigid carrier material (such as aluminum or zinc) that can be chemically etched without attacking the copper coating, the etching process that would normally be harmful is instead used to selectively remove only the carrier material, leaving the copper coating intact and exposing the conductive pattern structure.
Solution Approach 2:
The patent changes the chemical parameters of the etching process to achieve selective removal. By controlling the etchant composition and conditions to specifically target the rigid carrier material while being inert to copper, the process parameters are optimized to remove the carrier without damaging the copper coating, thus resolving the contradiction between detachment and coating integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of ultra-thin conductive pattern structures and multilayer structures with minimized bending risks, facilitating component assembly and enhancing the reliability of electrical connections by maintaining the copper coating's integrity during separation.
Implementation Method 1
the rigid carrier is composed of an amphoteric material or metal which can be dissolved in a basic solution that does not attack copper. Thus, for example, aluminium or an aluminium alloy can be used as a material for the rigid carrier and the detachment can be carried out by etching off the rigid carrier in caustic soda without the electrodeposited copper coating of the carrier being attacked.
Implementation Method 2
a thin copper layer having a thickness of less than 17 μm is electrodeposited on a temporary carrier of aluminium
Data Source
AI summary
The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.