Semiconductor Package Sealing Layer Surface Area Enhancement

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Solution Overview

Problem

Conventional semiconductor packages face limitations in heat dissipation performance due to the flat sealing layer, which restricts the efficient removal of heat generated by semiconductor chips, potentially leading to malfunction or damage from excessive temperature.

Innovation Solution

The method involves forming asperities on the sealing layer by using a profile grinding tool with an uneven surface or a mold with an uneven inner surface, increasing the surface area for heat dissipation without damaging the semiconductor chips, and dividing the package substrate along defined lines to create individual packages with enhanced heat dissipation capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a flat sealing layer is used to seal semiconductor chips, then the manufacturing process is simple and the structure is easy to produce, but the heat dissipation performance is limited

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidsealing layer structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent applies curvature by forming an uneven surface with ridges and grooves on the sealing layer instead of using a flat surface. The profile grinding tool with an uneven working surface creates this curved topology, increasing the surface area for heat dissipation while maintaining the sealing function.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent transitions from a two-dimensional flat sealing layer to a three-dimensional uneven surface with ridges and grooves. This dimensional change increases the surface area available for heat dissipation without significantly complicating the manufacturing process, as the uneven surface is formed during the sealing process itself.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the sealing layer surface area is increased to improve heat dissipation, then heat dissipation performance improves, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidprocessing steps

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent merges the heat dissipation function with the sealing layer formation process. The uneven surface is created during the sealing process itself using a profile grinding tool, combining two functions (sealing and heat dissipation surface creation) into one integrated process rather than requiring separate manufacturing steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The sealing layer serves multiple functions: it provides mechanical protection for the semiconductor chips, maintains hermetic sealing, and creates an uneven surface for enhanced heat dissipation. This multi-functionality reduces the need for additional components or processing steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Area of stationary object

If a profile grinding tool with uneven working surface is used to form ridges and grooves, then surface area increases for heat dissipation, but the risk of damaging semiconductor chips increases

Engineering Contradiction:

Improvesealing layer surface areaVSAvoidchip integrity

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The patent applies local quality by creating the uneven surface only on the sealing layer material, not on the semiconductor chips themselves. The profile grinding tool is designed to remove sealing compound and form ridges and grooves while stopping before contacting the chips, ensuring localized modification without compromising chip integrity.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses partial action by removing only a portion of the sealing compound to form the uneven surface, rather than completely removing or drastically altering the sealing layer. This partial removal is sufficient to create the heat dissipation features while maintaining adequate sealing coverage and avoiding chip damage.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves heat dissipation from semiconductor packages by increasing the surface area of the sealing layer, allowing for more efficient heat transfer and reduction in temperature, while maintaining mechanical strength and reducing the number of processing steps.

Implementation Method 1

a ridge forming step of cutting a front side of the sealing layer to a depth not reaching a front side of each semiconductor chip by using a profile grinding tool having an uneven working surface

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS10937668B2Semiconductor package manufacturing method

Publication Date: 2021.03.02 DISCO CORP

AI summary

A semiconductor package manufacturing method includes the steps of bonding a plurality of semiconductor chips to the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to thereby form a sealing layer from the sealing compound on the front side of the wiring substrate, thereby forming a package substrate, next holding the package substrate on a holding tape, next cutting the front side of the resin layer by using a profile grinding tool to thereby form a plurality of ridges and grooves on the front side of the resin layer, thereby increasing the surface area of the front side of the resin layer, and next dividing the package substrate along each division line to obtain a plurality of individual semiconductor packages.