Partially Plated Microphone Can Prevents Solder Creep
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Solution Overview
Problem
Solder creep and flow in microphone assemblies cause damage to internal components and interfere with gasketing, as the entire lid is typically plated with expensive metals like gold, leading to unwanted solder migration within the cavity and on the exterior.
Innovation Solution
A partially plated metal can, constructed from base metals like brass or stainless steel, with selective plating to control solder creep, allowing the solder to run only on plated sections while preventing it from reaching internal components, thus reducing manufacturing costs and eliminating the need for full gold plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the entire lid is plated with expensive metals like gold, then sufficient metallic bonding is achieved between the metal can and base, but manufacturing costs increase significantly
Solution Approach 1:
The patent applies selective plating by depositing solder-resistant metal coating only on specific portions of the lid where solder creep occurs, rather than plating the entire lid. This localized approach maintains the necessary metallic bonding strength at critical interfaces while significantly reducing the amount of expensive plating material required, thereby lowering manufacturing costs.
2Reliability
If the entire lid is plated with gold, then solder creep is controlled, but manufacturing costs increase significantly
Solution Approach 1:
The patent implements selective plating on specific portions of the lid where solder creep is most problematic, such as the upper surface and edges. This localized plating strategy maintains reliable solder creep control at critical areas while reducing the overall quantity of expensive gold or other precious metals used, thereby achieving cost reduction without sacrificing reliability.
Solution Approach 2:
The patent applies plating only to the extent necessary to control solder creep - specifically on the upper surface, edges, and other critical portions of the lid where solder migration occurs. This partial plating approach provides sufficient solder creep control without the excessive cost of complete lid plating, optimizing the balance between reliability and manufacturing cost.
3Reliability
If full gold plating is applied to the lid, then solder creep is prevented, but the cost of manufacturing increases
Solution Approach 1:
The patent applies solder-resistant metal plating selectively to specific portions of the lid including the upper surface, edges, and other areas where solder flow and creep occur. This localized plating maintains effective solder flow prevention at critical interfaces while significantly reducing the amount of expensive plating material required compared to full lid plating, thereby lowering manufacturing costs while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents solder creep and flow into sensitive areas, reduces manufacturing costs by minimizing gold plating and allowing the use of cheaper materials like stainless steel, and maintains sufficient metallic bonding between the metal can and base, enhancing the structural integrity of the microphone assembly.
Implementation Method 1
the solder will melt and continues to interact with the plating, and 'creeps' up the lid or flows
Data Source
AI summary
An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.