Camera Assembly RDL Integration for Thin Lens Modules
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Solution Overview
Problem
Conventional lens modules face challenges in miniaturization and thinning due to the separation of photosensitive chips and functional components, leading to increased size and reduced signal transmission speed, which affects shooting and storage performance.
Innovation Solution
The integration of photosensitive chips and functional components within an encapsulation layer, utilizing a redistribution layer (RDL) structure for electrical connections, reduces the distance between components and omits the need for a circuit board, thereby enhancing signal transmission speed and achieving miniaturization and thinning of the lens module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photosensitive chips and functional components are separated and mounted on different substrates, then ease of manufacture is improved, but device size increases and signal transmission speed decreases
Solution Approach 1:
The patent merges the photosensitive chip and functional components onto a single carrier substrate, eliminating the need for separate substrates and inter-substrate connections. This integration directly reduces device size while maintaining manufacturability through standardized mounting processes.
Solution Approach 2:
The patent transitions from a planar separation layout to a three-dimensional stacked arrangement within the encapsulation layer. Components are positioned at different vertical levels, allowing dense integration without increasing footprint area, thus reducing overall device volume.
2Ease of manufacture
If photosensitive chips and functional components are separated and mounted on different substrates, then ease of manufacture is improved, but signal transmission speed decreases
Solution Approach 1:
By combining photosensitive chips and functional components on the same carrier substrate, the patent eliminates inter-substrate signal paths and reduces connection lengths. This direct integration significantly improves signal transmission speed while maintaining manufacturing simplicity through established substrate mounting techniques.
3Ease of manufacture
If a circuit board is used to connect photosensitive chips and functional components, then ease of manufacture is improved, but device thickness increases
Solution Approach 1:
The patent extracts and eliminates the circuit board from the device architecture by directly mounting photosensitive chips and functional components on a carrier substrate. This removal of the intermediate circuit board layer directly reduces device thickness while maintaining ease of manufacture through simplified assembly processes.
Solution Approach 2:
The patent reorganizes component layout from a two-dimensional plane requiring a circuit board to a three-dimensional stacked configuration within the encapsulation layer. This vertical integration eliminates the need for a thick circuit board while maintaining electrical connections through direct substrate mounting.
4Measurement precision
If photosensitive chip imaging area is increased to improve imaging capability, then imaging quality is improved, but device area increases
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked arrangement, allowing the photosensitive chip to have a large imaging area without proportionally increasing the device footprint. Components are arranged vertically within the encapsulation layer, enabling high-resolution imaging in a compact form factor.
Data Source
AI summary
The present disclosure provides a camera assembly and a packaging method thereof, a lens module, and an electronic device. The packaging method of the camera assembly includes: providing a carrier substrate and forming a redistribution layer (RDL) structure on the carrier substrate; providing functional components having solder pads; forming a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip, that the photosensitive chip has solder pads facing the optical filter; temporarily bonding the optical filter of the photosensitive unit with the carrier substrate, and placing the functional components on the RDL structure, that each of the solder pads of the photosensitive chip and the solder pads of the functional components faces the RDL structure and electrically connects with the RDL structure; forming an encapsulation layer covering the carrier substrate, that the encapsulation layer is coplanar with a highest top of the photosensitive chip and the functional components; and removing the carrier substrate.