PCB Insulating Cover with Bulge for High-Voltage Isolation
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Solution Overview
Problem
Existing methods for insulating components on printed circuit boards in high-voltage environments are limited by the thickness and reliability of paint layers and glob top encapsulation, which can be prone to detachment due to thermomechanical loads and thermal expansion differences.
Innovation Solution
A circuit board assembly featuring an electrically insulating cover layer with a bulge that encases components, providing a three-dimensional insulation shell, which can be made flexible and thin to minimize thermal mass and allow for precise control of insulation performance, and can be produced using thermoforming or lamination processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a paint layer is applied to reduce creepage distances, then electrical insulation is improved, but the layer thickness is very limited and effectiveness is reduced
Solution Approach 1:
The patent transitions from two-dimensional planar insulation (paint layers on the circuit board surface) to three-dimensional insulation by forming bulges that extend vertically. This dimensional change allows the insulation structure to provide adequate creepage paths without requiring thick paint layers, thereby resolving the limitation of thin paint effectiveness while maintaining manufacturing feasibility.
Solution Approach 2:
The patent uses a flexible insulating membrane that can be formed into bulges to create three-dimensional insulation structures. This thin film approach provides effective electrical insulation with minimal material thickness, overcoming the limitation of paint layers while maintaining ease of manufacture through lamination or bonding processes.
2Reliability
If glob top encapsulation material is cast to reduce clearance and creepage distance, then electrical insulation is improved, but the layer thickness is difficult to control precisely and glob top can detach under thermomechanical loads
Solution Approach 1:
The patent replaces the rigid glob top encapsulation with a flexible insulating membrane that can be formed into bulges. This flexible film structure conforms to the component shapes and provides continuous insulation without the detachment problems of cast materials, while allowing precise control of insulation thickness through the membrane formation process.
Solution Approach 2:
The patent divides the insulation function into separate modular bulges formed from the insulating membrane, each enclosing specific components or conductor tracks. This segmentation allows independent optimization of each insulation zone and prevents the entire structure from failing due to thermomechanical stress, as each bulge can move independently with its enclosed component.
3Reliability
If an electrically insulating cover layer with bulge is used to encase components, then electrical insulation reliability is improved, but device complexity increases
Solution Approach 1:
The insulating membrane serves multiple functions simultaneously: it provides electrical insulation, acts as a protective cover, defines creepage paths, and can be formed into bulges to accommodate components. This multi-functionality reduces the need for separate insulation components, thereby decreasing overall device complexity despite the three-dimensional bulge structure.
Solution Approach 2:
The patent merges the insulating cover layer with the circuit board assembly by laminating or bonding the membrane directly to the board. The bulges are formed integrally from the same membrane material, combining what could be separate components into a unified insulation structure that simplifies assembly and reduces part count.
4Reliability
If thick insulation layers are used to ensure electrical insulation in high-voltage environments, then insulation performance is improved, but thermal mass increases and space requirements increase
Solution Approach 1:
The patent uses vertical bulges extending from the circuit board surface to create three-dimensional insulation paths. This dimensional approach provides adequate creepage distances for high-voltage insulation without requiring uniformly thick insulation layers across the entire board, thereby minimizing unnecessary thermal mass while maintaining insulation performance where needed.
Solution Approach 2:
The insulating membrane with bulges provides enhanced insulation thickness only in specific locations where components or conductor tracks require protection. The rest of the circuit board maintains its original thin-profile characteristics, optimizing the balance between insulation performance and thermal mass by applying insulation locally rather than uniformly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and space-efficient electrical insulation of components in high-voltage environments, reducing mechanical stress and maintaining insulation performance across temperature changes, while allowing for flexible integration and cost-effective mass production.
Implementation Method 1
The electrically insulating cover layer can, for example, first be preformed and then laminated onto the assembled circuit board
Implementation Method 2
The electrically insulating cover layer can, for example, first be preformed and then laminated onto the assembled circuit board
Data Source
Figure 1~2
Figure 3A~3D
AI summary
The invention relates to a printed circuit board assembly (10) comprising a printed circuit board (12) with at least one electrically insulating base layer (14) and an electrically conductive layer (16) arranged thereon; a component (20) arranged on a side of the electrically conductive layer (16) facing away from the base layer (14), which is electrically connected to the electrically conductive layer (16); and an electrically insulating cover layer (22) having a protrusion (24) in the vertical direction (z) of the printed circuit board assembly (10) in which the component (20) is enclosed between the electrically conductive layer (16) and the cover layer (22). The invention further relates to a method for manufacturing such a printed circuit board assembly (10).