Modular Heat Transfer Assembly for Circuit Card Thermal Management
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Solution Overview
Problem
Space limitations in circuit card assemblies hinder the effective customization and implementation of heat dissipation mechanisms for electronic components, as existing solutions are not adaptable to varying component configurations, leading to suboptimal thermal performance.
Innovation Solution
A heat transfer assembly comprising a thermally conductive plate, heat pipes, and a modular thermally conductive member that can be selectively positioned based on the location of electronic components, enhancing heat dissipation by combining improved heat pipe configurations and a custom-fit plate to optimize thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation mechanisms are customized to match electronic component configurations, then thermal performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat dissipation mechanism incorporates adjustable and reconfigurable elements that can be dynamically positioned to match different electronic component layouts. The frame structure allows for flexible arrangement of heat transfer assemblies, enabling adaptation to various component configurations without requiring completely different heat dissipation designs for each scenario.
Solution Approach 2:
The heat dissipation system is divided into modular segments including multiple heat transfer assemblies, each capable of being independently positioned and configured. This segmentation allows the system to adapt to different electronic component arrangements by selectively activating and positioning specific heat transfer segments near the required components.
2Volume of moving object
If space limitations are considered in circuit card assemblies, then compactness is improved, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The heat dissipation components are nested within the existing circuit card assembly structure. The heat transfer assemblies are integrated into the frame that already supports the circuit board, and heat pipes are positioned to extend from heat generating components through the frame structure, utilizing the existing spatial arrangement rather than adding external bulk.
Solution Approach 2:
The heat dissipation mechanism utilizes the vertical dimension and three-dimensional space within the frame structure. Heat pipes extend vertically from components through the frame, and heat transfer assemblies are positioned at different elevations, effectively using the Z-axis to improve heat dissipation without increasing the horizontal footprint of the assembly.
3Device complexity
If generic heat dissipation mechanisms are used, then device complexity is reduced, but adaptability to different component configurations deteriorates
Solution Approach 1:
The heat dissipation mechanism is designed with universal features that allow it to serve multiple configuration scenarios. The frame structure and heat transfer assemblies can be positioned to accommodate different electronic component layouts, enabling a single design to adapt to various functionality requirements without requiring complete redesign for each application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves thermal performance, enabling the mounting of high-power electronic components by reducing thermal resistance and allowing for customizable heat transfer mechanisms that adapt to different component configurations, thus enhancing the overall efficiency of heat dissipation.
Implementation Method 1
a heat pipe coupled to the first plate
Implementation Method 2
a thermally conductive member positioned between the at least one electronic component and the heat pipe
Data Source
Figure 1
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Figure 3
AI summary
A circuit card assembly is provided. The assembly includes a first printed circuit board 120, at least one electronic component 128 mounted on the first printed circuit board 120 at a predetermined location, a frame 122 coupled to the first printed circuit board 120, and a heat transfer assembly 124 coupled to the frame 122. The heat transfer assembly 124 includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe 160 coupled to the first plate, and a thermally conductive member 162 positioned between the at least one electronic component 128 and the heat pipe 160. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.