LCOS Panel Carrier Anisotropic Conductive Adhesive Interconnect
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Solution Overview
Problem
Conventional LCOS display manufacturing processes are hindered by the fragility and labor-intensive nature of wire bonding, which increases costs and reduces the robustness of LCOS devices.
Innovation Solution
A panel carrier system that eliminates wire bonds by using a conductive-layer electrode and address electrodes to electrically connect the LCOS panel to a printed circuit assembly, employing anisotropic conductive layers for robust and easier connections, replacing the need for wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect bond pads to FPCA, then electrical connection is achieved, but the connection process becomes labor-intensive and costly due to fragility
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a direct anisotropic conductive adhesive bonding process. Instead of using mechanical wires to establish electrical connections, the invention uses anisotropic conductive adhesive that provides both mechanical bonding and electrical conduction simultaneously, eliminating the need for separate wire bonding steps and reducing manufacturing complexity
Solution Approach 2:
The patent merges the electrical connection function and mechanical bonding function into a single anisotropic conductive adhesive layer. This adhesive simultaneously provides structural support to hold the LCOS panel and establishes electrical pathways between bond pads and FPCA, consolidating multiple functions into one component and simplifying the overall manufacturing process
2Reliability
If wire bonding is used to connect bond pads to FPCA, then electrical connection is achieved, but manufacturing costs increase due to labor-intensive process
Solution Approach 1:
The patent replaces the labor-intensive mechanical wire bonding process with a direct adhesive bonding process that can be automated. The anisotropic conductive adhesive is applied in a manner that allows for automated positioning and bonding, significantly improving manufacturing efficiency while maintaining reliable electrical connections through the adhesive's inherent conductive properties
Solution Approach 2:
The anisotropic conductive adhesive performs multiple functions simultaneously - it provides mechanical bonding to hold the panel, establishes electrical connections between bond pads and FPCA, and eliminates the need for separate wire bonding operations. This self-service approach consolidates multiple manufacturing steps into a single process, improving productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and robustness of LCOS devices by simplifying the connection process, reducing fragility, and lowering manufacturing costs, while maintaining electrical integrity.
Implementation Method 1
employing anisotropic conductive layers for robust and easier connections
Data Source
AI summary
A liquid-crystal-on-silicon (LCOS) panel includes a wafer having bond pads thereon, a liquid crystal layer, and a conductive layer. The panel carrier for the LCOS panel includes a conductive-layer electrode for electrically connecting the conductive layer to a printed circuit assembly (PCA), address electrodes for electrically connecting the bond pads to the PCA, and a cavity for holding the LCOS panel. The cavity includes a conductive pad for electrically connecting the conductive layer to the conductive-layer electrode, and bond-pad electrodes for electrically connecting each bond pad to a respective address electrode. A method for electrically connecting an LCOS panel to a panel carrier includes a step of electrically connecting each bond pad to a respective address electrode, and a step of electrically connecting the conductive layer to the conductive pad.