PCB Sensor with Built-in Media Channel
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Solution Overview
Problem
Existing sensor device packaging methods, such as using epoxy sealants, are costly, complex, and prone to failure over time, making it challenging to achieve a small, reliable form factor.
Innovation Solution
A sensor device with a printed circuit board (PCB) substrate featuring a built-in media channel and over-molding of the sensor chip and components, providing a mechanical seal and electrical connectivity while allowing a medium to pass through, thus simplifying manufacturing and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy sealant is used to seal between substrate and plastic lid, then pressure can be held, but manufacturing cost increases and assembly time extends
Solution Approach 1:
The patent combines the sealing function and structural support function into a single molded package body. The package body is molded to directly engage with the substrate edges, eliminating the need for separate epoxy sealant application. This merging of functions reduces assembly steps and manufacturing cost while maintaining reliable pressure containment.
Solution Approach 2:
The molded package body provides self-aligning and self-sealing features through its geometry. The package body includes engagement features that automatically position and seal against the substrate edges during assembly, eliminating the need for manual epoxy application and curing processes.
2Reliability
If epoxy sealant is used to seal between substrate and plastic lid, then pressure can be held, but assembly process complexity increases
Solution Approach 1:
The patent combines multiple functions (sealing, structural support, and alignment) into a single molded package body component. This reduces the number of parts and assembly steps, simplifying the overall assembly process while maintaining reliable pressure containment.
Solution Approach 2:
The package body is designed with self-aligning engagement features that automatically position itself relative to the substrate during assembly. This eliminates the need for complex alignment procedures and manual epoxy application, reducing assembly process complexity.
3Reliability
If epoxy sealant is used for sealing, then pressure containment is achieved, but reliability decreases over time
Solution Approach 1:
The patent replaces the epoxy sealant (which degrades over time) with a molded package body made from durable plastic material. The package body is designed to provide long-term pressure containment without the aging and degradation issues associated with epoxy sealants.
Solution Approach 2:
The package body integrates the sealing function directly into its structural design, creating a permanent, non-degrading seal. This eliminates the need for separate sealant materials that can fail over time, improving long-term reliability and durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a smaller, more reliable sensor device package with improved mechanical strength and reduced manufacturing complexity, offering a simpler and more efficient packaging method compared to traditional approaches.
Implementation Method 1
a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate
Implementation Method 2
a media channel in the PCB substrate allowing a medium to pass through
Data Source
AI summary
A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.