Micro Electronic Component Structure for Reliable USB Connections
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Solution Overview
Problem
The complex manufacture process and material requirements for USB 3.0 pin modules with different pin types lead to structural variations and height differences, resulting in poor electrical contact due to elastic fatigue and improper force during repeated insertion and removal, which affects the reliability of USB connections.
Innovation Solution
A micro electronic component structure featuring an insulating body with conductive through holes and micro terminals made of elastic materials, using a bonding material to form a sealed cyclic structure that avoids elastic fatigue and deformation, with adjustable conductive material sizes for enhanced stability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a pin module with two different types of pins is manufactured independently and then jointed to the substrate, then the USB 3.0 transmission interface can be formed, but the manufacture process becomes more complex and more materials are needed due to greater structural variation and height difference
Solution Approach 1:
The patent merges USB 2.0 and USB 3.0 pin structures into a single integrated pin module, eliminating the need for separate manufacturing and joining processes. The pin module includes both types of pins formed simultaneously on the substrate, reducing manufacturing complexity and material usage while maintaining compatibility with both USB standards.
2Productivity
If conventional USB pins are pulled and plugged repeatedly, then data transfer function is maintained, but electrical contact becomes poor due to improper force and collision deformation or due to elastic fatigue of the pin
Solution Approach 1:
The patent incorporates an elastic structure at the bottom of the pin module that provides pre-compression force to the contact pins. This elastic cushioning structure compensates for deformation and wear during repeated insertion and removal operations, maintaining consistent electrical contact pressure and preventing poor contact without requiring active adjustment mechanisms.
3Area of stationary object
If the diameter of the conductive through hole at the bottom surface is made greater than at the top surface, then the jointing area with the connecting pad is increased, but the structural precision of the through hole becomes more difficult to control
Solution Approach 1:
The patent employs an asymmetric through hole structure where the hole diameter varies along its length - smaller at the top surface and larger at the bottom surface. This asymmetric design increases the jointing area at the bottom for better electrical connection while maintaining a smaller top opening for easier alignment and insertion. The gradual transition is achieved through controlled drilling or etching processes that manage the complexity of creating tapered holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure provides a reliable and stable electrical connection by avoiding elastic fatigue and deformation, maintaining efficient contact over time, and extending the lifespan of electronic components through dual elasticity and sealed gas compression, improving manufacturing simplicity and product reliability.
Implementation Method 1
since the bonding material forms a sealed cyclic structure and the internal gas is compressed, the deformed structure is supported in a vapor-pressure type additionally
Implementation Method 2
the micro terminal made of an elastic material and a bonding material with an elastic effect
Data Source
AI summary
A micro electronic component structure includes an insulating body, at least one conductive through hole, at least one conductive material, and at least one micro terminal. The insulating body has a top surface and a bottom surface. The conductive through hole penetrates the top surface and the bottom surface. The conductive material is formed in the conductive through hole. The micro terminal is disposed above the conductive material.