BGA Package Through-Hole Segmentation for Thermal Management
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Solution Overview
Problem
Conventional ball grid array packages face inefficiencies in heat dissipation due to dense through hole arrangements, which interrupt heat paths and degrade signal quality by minimizing the surface area of the ground plane layer.
Innovation Solution
The design incorporates an array of ball pads and vias with strategically positioned rings of clearances in the chip-interposed region, providing increased spacing and channels for improved heat dissipation and signal transmission by ensuring larger intervals between adjacent vias and clearances, allowing for effective lateral heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If through holes are densely arranged in the chip-interposed region for signal transmission, then the number of I/O connections is increased, but heat dissipation efficiency deteriorates due to interrupted heat paths
Solution Approach 1:
The through holes are segmented into two distinct groups: a first group arranged in a first array pattern and a second group arranged in a second array pattern. This segmentation allows the heat dissipation paths to be separated from the signal transmission paths, enabling dense I/O connections while maintaining effective heat dissipation through dedicated thermal pathways.
Solution Approach 2:
Different regions of the substrate are assigned different functions: the first group of through holes is optimized for signal transmission with specific spacing and arrangement, while the second group is optimized for heat dissipation with different spacing and arrangement. This local differentiation allows each region to perform its specific function effectively without compromising the other.
2Quantity of substance
If through holes are densely arranged in the chip-interposed region, then more signal paths are provided, but the surface area of the ground plane layer is minimized affecting signal quality
Solution Approach 1:
The through holes are divided into two separate groups with distinct array arrangements. The first group is positioned to minimize interference with the ground plane layer, preserving its surface area for optimal signal quality, while the second group provides additional signal paths through alternative routing that does not compromise ground plane integrity.
3Ease of manufacture
If clearances of through holes are formed by etching the ground plane layer, then manufacturing is simplified, but manufacturing errors cause non-uniform clearance affecting heat dissipation paths
Solution Approach 1:
The through holes are segmented into two groups with different array arrangements. The first group is positioned and spaced to be less sensitive to etching variations, while the second group compensates for any non-uniformity. This dual-array approach reduces the overall impact of manufacturing errors on heat dissipation path uniformity.
Solution Approach 2:
The design incorporates two different array patterns with varying parameters (spacing, orientation, density). By having multiple configurations, the system can tolerate variations in clearance dimensions caused by etching errors, as the overall heat dissipation performance is maintained through the combined effect of both arrays rather than relying on precise uniformity of a single array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency and maintains signal quality by creating more extensive heat dissipation loops and reducing the likelihood of signal interference, thereby extending the service life of semiconductor device packages.
Implementation Method 1
the heat-dissipation path along the copper material between any two adjacent holes
Data Source
AI summary
The through holes in an array manner in the signal layer within the chip-interposed region on a substrate of a BGA package comprise a ball pads array having a plurality of ball pads and a vias array. The vias array has a plurality of vias located interlaces with the ball pads array. The outermost portions of the chip-interposed region are designed in such a manner to have at least two rings of vias for signal transmission and power connection. The interval between every two adjacent vias in the ring is not less than twice of the distance of two ball pads. Upon such an arrangement, the BGA package can have a plurality of dissipation channels that can increase dissipation space, dissipate quickly the heat generated from the IC, and transmit well for signal and power.