Semiconductor/Solid-State Device Details TRIZ Cases

Vertical stacking with an internal interposer reduces signal path length and parasitic inductance while improving heat dissipation.

Connector formations guide solder by capillary action, reducing stress concentration and improving thermal cycling reliability.

A wiring board uses plating and conductive paste in laminated layers to form continuous conductors along a single axis.

A dielectric bonding pattern definition layer with openings guides metal pad expansion during semiconductor wafer assembly.

Copper-resin composite through-hole electrodes match silicon oxide thermal expansion, preventing cracks under thermal loads.

Embedding conductive paste into through electrode holes via back-surface bump forming masks prevents bump adhesion to support adhesives during wafer peeling.

A GaN sensor uses gate electrodes to deplete a two-dimensional electron gas channel, creating a subthreshold operating regime for high sensitivity.

A semiconductor module uses a resin lid thick part as a bending fulcrum for terminals without external jigs.

Segmented substrate with opposite conductivity regions blocks parasitic leakage currents during gate oxide breakdown, ensuring consistent operation.

A single alloy conductor forms simultaneous ohmic contacts to n- and p-type silicon carbide surfaces.

Multi-level fan-out interconnects reduce insertion loss and impedance peaks by shunting current away from extensive interconnect paths.

A capacitor formed by conducting wires and an insulating layer protects GOA circuits from static discharge damage.

A resiliently compressible hold down clip secures a heat sink to a printed circuit board using retaining fingers that insert into board openings.

Eliminating organic substrates through redistribution layers and molding compounds reduces manufacturing costs and form factor while enhancing reliability.

A semiconductor wiring board uses radial bonding leads to mount chips of varying sizes without redesign.

Conductive posts link the shielding layer to ground through bridge dies, reducing contact resistance and improving electromagnetic interference shielding.

Recessed and raised structures on a middle member prevent vapor passage collapse while improving liquid return efficiency.

Interleaved sidewall fins enhance rigidity and thermal dissipation, resolving overheating risks in dense three-dimensional module packaging.

Cavity structures embed capacitors and solder balls within package substrates to reduce z-height and x-y dimensions.

Low-power plasma densification reduces barrier layer thickness while maintaining underlying metal integrity.

A die-pad with predefined slots and partial saw isolation grooves partitions the substrate into side pads and a die attach pad for integrated circuit packaging.

A ball grid array package uses segmented through-hole arrays to create dedicated thermal pathways.

Protruding parts on the package bottom surface create gaps for solder flow, resolving incomplete connections caused by poor penetration.

Tempering a Ti-Al-NiV layer stack forms inter-metallic phases that prevent corrosion-induced breakage in semiconductor chip joints.

Openings in a supporting structure hold chips during encapsulation, reducing warping and boosting yield.

A clipped dielectric layer embeds a pad to support conductive pillars with high aspect ratios.

A wiring substrate incorporates a primer layer on fiber-reinforced resin to prevent twist or warp during thermal manufacturing processes.

Post-stacking chip identifier allocation uses shared signal lines and multiplexers to assign unique IDs without dedicated wiring, reducing manufacturing costs.

A continuous conductive layer forms a seamless connection between stacked memory pillars using a sacrificial layer replacement process.

A film-type wafer mold material with a low elastic modulus resin layer enables efficient collective molding of large-diameter thin-film wafers.

Integrating soft magnetic films around redistribution wiring coils boosts inductance and reduces resistance, eliminating discrete component placement.

Protective layer shields under-bump layer side faces from moisture corrosion, ensuring stable electrical connections in semiconductor devices.

Lead frame with isolated pads and connectors supports integrated circuit die attachment and encapsulation for compact packaging.

Large metal crystal grains cut by side surfaces reduce electrical resistance in miniaturized trenches, eliminating high-resistance barrier layers.

A low transmittance encapsulant seals the image sensor chip and transparent lid to block ambient light entry.

A semiconductor package uses a dual-height molding compound to encapsulate the substrate and chip while exposing conductive bodies.

Tubular spring electrode eliminates edge portions to distribute short-circuit currents, preventing local heating and breakage in press-pack IGBT modules.

Removing the ceramic substrate from a flip-chip LED package reduces thermal resistance and improves light emission efficiency.

A stacked titanium nitride and nickel metal film structure provides a high work function gate electrode for semiconductor devices.

Pre-positioned interconnect bridge devices join integrated circuit chips on a bridge wafer to form modular multi-chip modules.

Two-step plated metal pillars enable finer pitch stacking, resolving integration density and packaging complexity trade-offs.

Varying porosity in the thickness direction eliminates film interfaces, preventing leakage paths and improving device reliability.

Redistribution layer interposer reduces wire length and provides RF shielding between SoC and DRAM die, alleviating overhang issues without TSV complexity.

Composite sealing materials resolve low resin conductivity by routing heat through high-conductivity spacers and covers.

A micro LED display panel uses redundant device pairs bonded to a substrate to ensure uniform light emission.

Oval cavities and integrated lenses merge separate LEDs into one unit, resolving offset emission patterns that degrade far-field color mixing.

A rotating clip engages cooling device shafts through circuit board slots to secure thermal management components.

A coupling layer increases dielectric shear strength by a factor of two, reducing residual stress during low-temperature curing.

Positive-type photoresist defines high aspect ratio vias, eliminating residual material issues from negative BCB to enable smaller feature sizes.

A magnetic core inductor embedded in a package substrate uses shared interconnects to form protective rings that reduce eddy currents.