Integrated LED Package with Oval Cavities for Color Mixing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED displays with multiple LEDs per pixel are costly, complicated to fabricate, and suffer from less than optimal color mixing due to offset emission patterns, particularly in the far field.
Innovation Solution
LED packages with multiple oval-shaped cavities and lenses that approximate a point light source, allowing for improved color mixing and wide-angle emission, featuring anchoring features and encapsulant coverage to enhance reliability and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional through-hole techniques are used to mount separate LED lamps per pixel, then the display can achieve wide-angle emission, but the fabrication process becomes costly and complicated
Solution Approach 1:
The patent merges multiple separate LED lamps into a single integrated LED package containing multiple LED chips. This integration simplifies the fabrication process by reducing the number of mounting operations from multiple separate through-hole techniques to a single package insertion, while maintaining the wide-angle emission capability through proper optical design of the integrated package.
Solution Approach 2:
The patent segments the pixel function into multiple LED chips within a single package, where each LED chip contributes to different color emissions. This segmentation allows the package to function as a complete pixel unit with improved color mixing, eliminating the need for complex alignment of separate lamps while achieving reliable wide-angle emission.
2Illumination intensity
If LED lamps are spaced apart in conventional pixels, then wide-angle emission is achieved, but color mixing becomes less than optimal particularly in the far field
Solution Approach 1:
The patent nests multiple LED chips within a single integrated package structure, positioning them in close proximity. This nesting arrangement improves color mixing by allowing light from different LED chips to overlap and combine effectively, while the package's optical design maintains wide-angle emission characteristics through proper lens or reflector configuration.
3Adaptability or versatility
If multiple separate LED lamps are used per pixel, then the desired color combinations can be achieved, but the device complexity and cost increase
Solution Approach 1:
The patent combines multiple LED chips that can produce different color combinations into a single integrated package. This merging reduces the pixel structure complexity by consolidating what would otherwise require multiple separate lamp mountings into one unified component, while maintaining the versatility to achieve desired color combinations through controlled emission from each integrated LED chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies manufacturing, enhances color mixing and emission reliability, and extends the lifespan of LED displays while reducing moisture intrusion, leading to more efficient and durable LED packages and displays.
Implementation Method 1
Light emitting diodes (LED or LEDs) are solid state devices that convert electric energy to light, and generally comprise one or more active layers of semiconductor material sandwiched between oppositely doped layers. When a bias is applied across the doped layers, holes and electrons are injected into the active layer where they recombine to generate light.
Implementation Method 2
The LED packages are arranged with an encapsulant and a lens over the cavities to that help shape the LED package emission to a wide angle or pitch.
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities. Each of the packages comprises a lens over each cavity to produce an emission of the LEDs that has a wider angle compared to the emission without the lens. A potting material can be included between adj acent ones of the LED packages and overlaps the package encapsulant to further improve reliability.