Integrated Circuit Package System With Partial Saw Isolation Grooves
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Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices, particularly in terms of cooling, reliability, and cost-effectiveness, with increasing complexity and risk of errors during manufacture, while struggling to meet the demands of smaller footprints and more robust packages.
Innovation Solution
The implementation of an integrated circuit package system that includes a die-pad with predefined slots and partial saw isolation grooves along a single axis, partitioning it into side pads and a die attach pad, and encapsulating the integrated circuit and bond wire, which improves manufacturing efficiency and reduces costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods are used for high-speed devices, then device functionality is maintained, but manufacturing complexity and error risk increase significantly
Solution Approach 1:
The die-pad is segmented into multiple isolated pads (first pad, second pad, third pad) through partial saw isolation grooves, allowing independent handling and assembly of different functional components. This segmentation simplifies the manufacturing process by enabling modular assembly while maintaining device functionality.
Solution Approach 2:
The isolation grooves extract and remove material between pads to create physical separation, eliminating the need for complex isolation structures or additional processing steps. This extraction approach simplifies the overall packaging structure while ensuring proper electrical and physical isolation between components.
2Reliability
If advanced packaging features are implemented to meet high-speed device requirements, then device performance is improved, but manufacturing cost increases
Solution Approach 1:
Multiple functional pads (signal pad, power pad, ground pad) are combined into a single die-pad structure with integrated isolation grooves. This merging approach maintains advanced packaging features for high-speed device performance while simplifying manufacturing by reducing the number of separate components and assembly steps.
Solution Approach 2:
The partial saw isolation grooves are created preliminarily during the die-pad fabrication process before final assembly. This preliminary action ensures proper isolation and positioning is established early, preventing the need for costly post-assembly adjustments or rework.
3Area of moving object
If smaller footprint packages are produced to meet portable device requirements, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The die-pad employs local quality differentiation through specialized pad structures - corner pads with extended portions for mechanical support, specific pad orientations for electrical connectivity, and strategically placed isolation grooves. This local differentiation optimizes each region's function within the compact footprint while maintaining manufacturability through standardized fabrication processes.
Data Source
AI summary
An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.