Chip Package Supporting Structure for Warping Control
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Solution Overview
Problem
The semiconductor industry faces challenges in increasing the structural strength and reducing production costs of chip packages, particularly during the packaging process, where warping occurs and yield is affected.
Innovation Solution
A chip package process involving a supporting structure with openings on a carrier plate, where chips are placed within these openings, encapsulated with material, and a redistribution structure is connected to the chips, enhancing structural strength and reducing costs by alleviating warping and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a supporting structure is added to increase structural strength, then the structural strength of the chip package is improved, but the device complexity and production cost increase
Solution Approach 1:
The supporting structure is divided into multiple segments corresponding to different chip packages in the array. Each supporting structure portion is localized to specific regions rather than being a continuous complex structure, reducing overall complexity while maintaining strength where needed.
Solution Approach 2:
The supporting structure serves multiple functions simultaneously: it provides structural strength to prevent warping, acts as a carrier for multiple chips, and serves as a base for the encapsulated material. This multi-functionality reduces the need for separate components, thereby reducing device complexity.
2Reliability
If a supporting structure is added to alleviate warping during packaging, then the reliability and yield are improved, but the device complexity and production cost increase
Solution Approach 1:
The supporting structure is prepared in advance on the carrier plate before chips are mounted and encapsulation is performed. This preliminary preparation ensures that the structural framework is already in place to prevent warping during subsequent packaging processes, improving reliability without adding complexity to later steps.
Solution Approach 2:
The supporting structure acts as an intermediary element between the carrier plate and the chips/encapsulated material. It mediates the mechanical stresses and prevents warping by providing a stable intermediate platform, thereby improving yield without requiring complex direct connections between chips and carrier.
3Device complexity
If the supporting structure is removed after encapsulation, then the device complexity is reduced, but the structural strength during the packaging process is compromised
Solution Approach 1:
The supporting structure provides temporary structural support and cushioning during the critical packaging and encapsulation processes. After these processes are complete and the structure has served its protective function, it can be removed. This temporary reinforcement ensures structural integrity during packaging without permanently increasing device complexity.
Data Source
AI summary
A chip package process includes the following steps. A supporting structure and a carrier plate are provided. The supporting structure has a plurality of openings. The supporting structure is disposed on the carrier plate. A plurality of chips is disposed on the carrier plate. The chips are respectively located in the openings of the supporting structure. An encapsulated material is formed to cover the supporting structure and the chips. The supporting structure and the chips are located between the encapsulated material and the carrier plate. The encapsulated material is filled between the openings and the chips. The carrier plate is removed. A redistribution structure is disposed on the supporting structure, wherein the redistribution structure is connected to the chips.