Integrated Circuit Packaging With Isolated Pads
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Solution Overview
Problem
The increasing miniaturization of integrated circuit packages poses challenges in manufacturing, including high input/output density, reliability of fine pitch connections, and efficient packaging of integrated circuit dies, which current technologies have not adequately addressed, leading to manufacturing problems and increased costs.
Innovation Solution
The implementation of an integrated circuit packaging system that includes a lead frame with a die attach paddle, isolated pads, and connectors, where the integrated circuit die is attached to the paddle and connector, and encapsulated, allowing for electrical isolation of the pads without additional singulation processes, thereby maintaining structural integrity and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional laminate packages are used to achieve high I/O density, then the number of inputs/outputs increases, but manufacturing complexity and cost increase due to additional singulation processes and delamination issues
Solution Approach 1:
The package is divided into separate modules, each containing an integrated circuit die and its associated pads. The lead frame is segmented into multiple sections that can be independently processed. This segmentation allows each module to be manufactured and tested independently before final assembly, reducing overall manufacturing complexity while maintaining high I/O density.
Solution Approach 2:
The patent transitions from planar pad arrangements to three-dimensional pad structures with isolated pads extending in multiple directions. This dimensional change allows for increased I/O capacity without proportionally increasing the package footprint, and enables simpler manufacturing by eliminating the need for complex singulation processes used in conventional laminate packages.
2Quantity of substance
If fine pitch connections are used to increase I/O density, then the number of connections increases, but reliability decreases due to manufacturing challenges
Solution Approach 1:
Pads are pre-formed on the lead frame before die attachment, and isolated pads are created in advance to establish electrical connections. This preliminary formation of connection points ensures proper alignment and reduces the risk of connection failures during subsequent assembly steps, thereby improving reliability while maintaining fine pitch connections.
Solution Approach 2:
The lead frame serves as an intermediary structure that provides mechanically robust connections between the integrated circuit die and the external circuit board. The isolated pads on the lead frame act as intermediate connection points that distribute electrical signals, reducing stress on individual fine pitch connections and improving overall connection reliability.
3Volume of moving object
If package size is reduced for miniaturization, then product size decreases, but manufacturing yield decreases due to increased I/O density challenges
Solution Approach 1:
By segmenting the package into modular units with standardized lead frame sections, the patent enables consistent manufacturing processes that can be scaled. Each module can be independently assembled and tested, improving manufacturing yield while allowing the overall package size to be reduced through efficient stacking and arrangement of these standardized modules.
Solution Approach 2:
The patent modifies key manufacturing parameters including pad geometry, lead frame thickness, and encapsulation materials to optimize for both miniaturization and manufacturing yield. The isolated pad structure with specific dimensional parameters enables high I/O density in reduced package sizes while maintaining manufacturability through standard fabrication processes.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.