Electro-optic Device Thermal Management via Composite Sealing
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Solution Overview
Problem
Existing electro-optic devices face temperature rise issues due to light irradiation and heat generation, leading to false operations and reduced lifespan, despite improved heat radiation configurations, as the thermal conductivity of sealing resins is insufficient to effectively manage chip temperatures.
Innovation Solution
The electro-optic device employs a spacer with higher thermal conductivity than the chip's contact surface, and a cover with even higher thermal conductivity, along with a sealing material to efficiently release heat, thereby suppressing chip temperature rise and enhancing device reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If sealing resin is used to cover the spacer and improve heat transfer from the cover, then the heat transfer efficiency from the cover to the sealing resin is improved, but the thermal conductivity of the sealing resin is low and the rise in temperature of the chip cannot sufficiently be suppressed
Solution Approach 1:
The invention uses a composite material structure where a first sealing resin with lower thermal conductivity is combined with a second sealing resin having higher thermal conductivity. The second sealing resin is positioned in contact with the chip to efficiently conduct heat away from the chip, while the first sealing resin provides the sealing function. This composite approach resolves the contradiction by combining materials with different properties to simultaneously achieve both sealing and effective heat dissipation.
2Loss of energy
If the cover is made of material with high thermal conductivity to release heat, then heat release capability is improved, but the complexity of material selection and manufacturing increases
Solution Approach 1:
The invention applies local quality by making different parts of the sealing structure have different thermal conductivity properties. Specifically, the second sealing resin that contacts the chip is selected to have high thermal conductivity for efficient heat release, while other sealing portions can use materials with lower thermal conductivity. This allows the cover and sealing structure to have locally optimized properties without requiring the entire structure to be made of high-performance materials, thus managing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents chip temperature increase by facilitating heat transfer and release, improving the reliability and lifespan of the electro-optic device.
Implementation Method 1
the spacer is made of a second material having second thermal conductivity higher than the first thermal conductivity
Implementation Method 2
the cover rises in temperature due to the irradiation of the light
Data Source
AI summary
An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.