Image Sensor Packaging with Black Encapsulant for Light Blocking
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Solution Overview
Problem
Conventional image sensor packaging structures face challenges in maintaining image sensing quality due to ambient light entry, multipath refraction, and increased complexity and cost associated with housing alignment and fabrication.
Innovation Solution
An image sensor packaging structure utilizing a low transmittance encapsulant to prevent ambient light entry, replacing the conventional housing, and simplifying assembly and material costs by encapsulating the chip and transparent lid with a black, non-penetrable encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a housing is used to block ambient light, then image sensing quality is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the light-blocking function with the encapsulant material that already serves to seal and protect the image sensor chip. By integrating the housing's light-blocking function into the encapsulant, the design eliminates the separate housing structure while maintaining ambient light rejection, thereby reducing device complexity and manufacturing steps.
Solution Approach 2:
The encapsulant is given multiple functions: it serves as both the sealing/protective element and the ambient light blocking element. This multi-functional design replaces the single-function housing structure, simplifying the overall device architecture while achieving the same light-blocking effect.
2Object-affected harmful factors
If a housing is used to block ambient light, then image sensing quality is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the light-blocking function with the encapsulant material that already serves to seal and protect the image sensor chip. By integrating the housing's light-blocking function into the encapsulant, the design eliminates the separate housing structure while maintaining ambient light rejection, thereby reducing device complexity and manufacturing steps.
Solution Approach 2:
The patent extracts the light-blocking function from the housing structure and transfers it to the encapsulant material. This extraction eliminates the need for a separate housing component, reducing part count and assembly steps, which directly lowers manufacturing cost while maintaining the essential light-blocking capability.
3Illumination intensity
If a transparent lid is used to cover the chip, then light transmission to the sensor is enabled, but ambient light can still enter from the sides
Solution Approach 1:
The patent applies different optical properties to different regions: the top surface (lid area) remains transparent to allow light transmission to the sensor, while the side surfaces (encapsulant area) are made opaque to block ambient light from entering sideways. This localized differentiation of material properties solves the contradiction between needing light transmission and preventing unwanted light entry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The low transmittance encapsulant effectively blocks ambient light, preventing multipath refraction and scattering, thereby maintaining image sensing quality while reducing parts, simplifying the fabrication process, and lowering material costs.
Implementation Method 1
a low transmittance encapsulant for encapsulating the image sensor packaging structure, blocking ambient light
Data Source
AI summary
An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.