Semiconductor Package Shielding Layer Ground Connection
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Solution Overview
Problem
Semiconductor packages face challenges in effectively connecting shielding layers to ground terminals, leading to increased contact resistance and poor electromagnetic interference shielding due to disconnected or poorly connected components.
Innovation Solution
A semiconductor package design featuring stacked sub-packages with bridge dies and conductive posts that electrically connect the shielding layer to the ground, reducing contact resistance and enhancing electromagnetic interference shielding by providing a reliable ground path through the bridge dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is connected to a ground terminal in a semiconductor package, then electromagnetic interference shielding is achieved, but contact resistance increases and connection reliability deteriorates due to process and structure limits
Solution Approach 1:
The ground connection path is segmented into multiple conductive posts distributed across different sub-packages (first to Nth sub packages). Each conductive post provides an independent connection path from the shielding layer to the ground terminal through bridge dies, avoiding single-point failure and reducing overall contact resistance through parallel pathways.
Solution Approach 2:
Bridge dies are introduced as intermediary components to facilitate reliable electrical connection between the conductive posts and ground terminals. The bridge dies contain redistribution layers that properly route and connect multiple conductive posts to ground terminals, ensuring stable and low-resistance connections while maintaining package integrity.
2Adaptability or versatility
If multiple sub-packages are stacked to achieve high integration, then device functionality is improved, but contact resistance between the shielding layer and ground terminal increases
Solution Approach 1:
The ground connection structure transitions from a planar two-dimensional layout to a three-dimensional vertical stack. Conductive posts are arranged vertically across multiple sub-packages stacked in the thickness direction, with bridge dies providing lateral connections. This vertical arrangement maintains short current paths and low contact resistance while achieving high integration through stacking.
Solution Approach 2:
Multiple functional elements are merged into integrated structures: conductive posts from different sub-packages are combined through bridge dies to form a unified ground connection system. The bridge dies integrate multiple connection functions (electrical connection, mechanical support, signal redistribution) into single components, reducing overall contact resistance while enabling high integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high integration and reduces contact resistance between the shielding layer and the semiconductor package, effectively blocking electromagnetic interference by ensuring a stable ground path, thereby improving the overall performance of the semiconductor package.
Implementation Method 1
The Nth conductive post of the Nth sub package electrically connects the Nth bridge die with the shielding layer and electrically connects with conductive posts among the first to (N−1)th pluralities of conductive posts to provide a ground providing path through the first to Nth bridge dies of the first to Nth sub packages
Data Source
AI summary
A semiconductor package includes a base substrate and first to Nth sub packages sequentially stacked over the base substrate with each sub package including a semiconductor die and a bridge die disposed on at least one side of the semiconductor die and electrically connected to the semiconductor die, where N is a natural number equal to or more than two (2). The semiconductor package also includes a molding layer formed on the base substrate and exposing an Nth conductive post included in the Nth sub package while covering the first to Nth sub packages. The semiconductor package further includes a shielding layer formed on the molding layer and electrically connected to the Nth conductive post.