Wiring Substrate Primer Layer Rigidity

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Thinning of the core substrate in wiring substrates leads to insufficient rigidity, causing twist or warp during the heating process in manufacturing, which compromises the reliability and handling of electronic component devices.

Innovation Solution

A wiring substrate is manufactured by forming a core substrate with a resin layer containing fiber reinforcement material and a primer layer, where via holes connect the first wiring layer to subsequent layers, enhancing rigidity and adhesion through the primer layer's roughened surface, preventing twist or warp during thermal processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the core substrate is thinned to reduce thickness, then the wiring substrate achieves miniaturization and higher performance, but sufficient rigidity cannot be obtained causing twist or warp during heating process

Engineering Contradiction:

Improvethickness of core substrateVSAvoidrigidity of core substrate

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The patent applies composite materials by forming an interlayer insulating layer that combines a resin layer containing fiber reinforcement material with a primer layer. This composite structure provides both the thinness required for miniaturization and the rigidity needed to prevent twist and warp during heating processes. The fiber reinforcement material embedded in the resin layer specifically addresses the rigidity requirement while maintaining reduced thickness.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by creating regions with different properties within the interlayer insulating layer. The resin layer containing fiber reinforcement material is positioned at specific locations to provide localized rigidity enhancement, while the primer layer is applied in specific regions to ensure proper adhesion. This allows the substrate to be thin overall while having strategically placed reinforcement zones where rigidity is critical.

Inventive Principle:

Principle #3Local quality

2Length of moving object

If the core substrate is thinned, then miniaturization is achieved, but twist or warp is caused during manufacturing heating process

Engineering Contradiction:

Improvethickness of core substrateVSAvoiddimensional stability during heating

Core Design Contradiction:

Length of moving objectVSStability of the object's composition

Solution Approach 1:

The composite structure of the interlayer insulating layer, combining fiber-reinforced resin with primer layer, provides thermal stability during manufacturing processes. The fiber reinforcement material resists thermal deformation, maintaining dimensional stability even when the overall substrate thickness is reduced for miniaturization applications.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies preliminary action by pre-forming the interlayer insulating layer with embedded fiber reinforcement material before subsequent manufacturing steps. This pre-reinforced structure is prepared in advance to withstand the heating processes that will occur during wiring layer formation, preventing twist and warp before they can occur.

Inventive Principle:

Principle #10Preliminary action

3Strength

If a resin layer containing fiber reinforcement material and a primer layer are laminated, then sufficient rigidity is obtained, but device complexity increases

Engineering Contradiction:

Improverigidity of core substrateVSAvoidstructure of interlayer insulating layer

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent applies merging by combining the reinforcement function and adhesion function into a single integrated interlayer insulating layer structure. The resin layer with fiber reinforcement and the primer layer work together as one functional unit, providing both rigidity and bonding capability without requiring separate, additional components. This reduces overall device complexity despite the enhanced functionality.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides sufficient rigidity to the core substrate, preventing twist or warp during manufacturing and improving handling and reliability, even when the core substrate is thinned to 100 μm to 200 μm, ensuring reliable adhesion of wiring layers and maintaining structural integrity.

Implementation Method 1

a resin layer containing fiber reinforcement material

Methodology Applied

Scientific EffectFiber reinforcement: Composite Materials

Implementation Method 2

a primer layer formed on the resin layer containing fiber reinforcement material

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9252096B2Wiring substrate and method of manufacturing the same

Publication Date: 2016.02.02 SHINKO ELECTRIC IND CO LTD

AI summary

A wiring substrate includes a core substrate including a first wiring layer, an interlayer insulating layer formed by a resin layer containing fiber reinforcement material formed on the core substrate and a primer layer formed on the resin layer containing fiber reinforcement material, and the interlayer insulating layer having a via hole reaching the first wiring layer, and a second wiring layer formed on the primer layer, and connected to the first wiring layer through the via hole.