Semiconductor Package Molding Compound with Dual-Height Substrate Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices require different molds for various package sizes, leading to increased production costs and mold insert gate marks, as well as potential pollution of substrate pads due to uneven molding compound coverage.
Innovation Solution
A semiconductor package design where a molding compound is formed with multiple heights, encapsulating the substrate, chip, and conductive bodies, with one end of each conductive body exposed, allowing for uniform coverage and reduced mold requirements by standardizing package sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different molds are used for different package sizes, then molding precision can be optimized for each package, but manufacturing cost increases dramatically
Solution Approach 1:
The patent applies universality by designing a standardized mold that can accommodate different package sizes through adjustable or interchangeable components. The mold is engineered with universal features that allow it to perform multiple functions for different package configurations, thereby eliminating the need for multiple specialized molds and reducing manufacturing costs while maintaining adequate molding precision
2Ease of manufacture
If a single mold is used for all packages, then manufacturing cost decreases, but molding precision and coverage uniformity deteriorate
Solution Approach 1:
The patent applies segmentation by dividing the mold into modular sections or layers that can be independently adjusted or configured. This allows the single mold to adapt to different package sizes and shapes while maintaining uniform molding coverage. The segmented structure enables precise control over mold cavity dimensions and positioning for each package type
3Reliability
If molding compound overflows onto substrate surface, then complete encapsulation is achieved, but pad pollution occurs
Solution Approach 1:
The patent introduces an intermediary barrier or protective layer between the molding compound and the substrate pads. This intermediary element prevents direct contact and pollution of the pads by the molding compound while still allowing complete encapsulation of the underlying components. The barrier could be a release film, protective coating, or precisely positioned mold feature that controls compound flow
4Ease of manufacture
If draft angle is increased to facilitate mold removal, then ease of manufacture improves, but package height and complexity increase
Solution Approach 1:
The patent replaces the traditional mechanical draft angle approach with an alternative mechanism such as a release agent, flexible mold material, or controlled debonding interface that allows mold removal without requiring significant package height increase. This substitution maintains a more compact package shape while still facilitating easy mold extraction through chemical or controlled mechanical means
Data Source
AI summary
The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.