Package Substrate Cavities for Reduced Z-Height
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Solution Overview
Problem
The increasing demand for reduced dimensions in mobile, tablet, and ultrabook technologies poses a challenge in minimizing the form factor of semiconductor packages, particularly due to the limited z-height and x-y dimensions determined by surface-mounted components like capacitors and solder balls.
Innovation Solution
The solution involves forming cavities within the package substrate's buildup layers to mount capacitors and semiconductor dies, as well as solder balls, which reduces the overall z-height and x-y dimensions by embedding these components within the substrate, allowing for the use of cheaper, larger capacitors and smaller solder balls, thereby minimizing the package's size without increasing the z-height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are mounted on the surface of the package substrate, then the components can be easily installed and connected, but the z-height and x-y dimensions of the package increase
Solution Approach 1:
The patent embeds components within cavities formed in the package substrate, nesting components inside the substrate volume rather than mounting them on the surface. This nesting approach reduces the package z-height while maintaining ease of manufacture through automated pick-and-place equipment that can deposit components into the cavities before final substrate curing
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding within the substrate. By forming cavities at different depths and positions within the substrate, the design utilizes the third dimension (depth) to accommodate components, thereby reducing the overall z-height footprint while maintaining component functionality
2Ease of manufacture
If components are mounted on the surface of the package substrate, then the components can be easily connected to external circuits, but the package x-y dimensions increase
Solution Approach 1:
Components are nested within cavities formed in the substrate, allowing multiple components to be accommodated within the substrate volume rather than requiring additional surface area. This enables high-density component placement without increasing the package x-y footprint
Solution Approach 2:
The substrate acts as a flexible embedding medium that can be formed with complex three-dimensional cavity structures. The substrate material accommodates components at various depths and orientations, enabling compact integration while maintaining electrical connectivity through conductive pathways within the substrate
3Ease of manufacture
If larger, cheaper capacitors are used, then the component cost decreases, but the package z-height increases
Solution Approach 1:
Larger capacitors are embedded within cavities formed in the substrate, nesting them within the substrate volume rather than mounting them on the surface. This allows the use of larger, more cost-effective capacitor components without increasing the package z-height, as the cavity depth accommodates the component height
Data Source
AI summary
A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.