Circuit Package Sidewall Fins for 3D Module Heat Dissipation
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Solution Overview
Problem
Three-dimensional integrated circuit packaging faces challenges in maximizing module density while minimizing space, leading to increased heat density and potential overheating due to close proximity of modules, and existing substrates may be fragile and prone to mechanical failure.
Innovation Solution
The circuit package design incorporates a plurality of sidewall fins that form an interleaving stacked relationship with modules, providing structural support and heat dissipation, and uses ceramic-based or organic-based module substrates that are smaller and lighter but require a more robust assembly to manage heat and mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If modules are packed closely in three-dimensional configuration to reduce space, then volume efficiency is improved, but heat dissipation becomes difficult and mechanical fragility increases
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by introducing sidewall fins that extend vertically between mounting plates. This dimensional transformation allows heat to be dissipated through multiple spatial dimensions simultaneously, resolving the contradiction between compact volume and effective heat dissipation in 3D module packaging.
Solution Approach 2:
The package structure is segmented into multiple functional components: mounting plates for module support, sidewall fins for heat dissipation, and spacing structures for thermal management. This segmentation allows each component to specialize in its function, enabling compact packaging while maintaining effective heat dissipation pathways.
2Productivity
If modules are packed closely to increase module density, then productivity is improved, but mechanical failure risk increases due to fragility
Solution Approach 1:
The patent incorporates protective elements such as molding compounds, encapsulants, and carefully designed spacing structures that cushion and protect fragile ceramic or organic substrates before mechanical failure can occur. These protective features are built into the package structure a priori, allowing high module density while maintaining reliability.
Solution Approach 2:
The package utilizes composite material structures including ceramic substrates combined with protective molding compounds, and mounting plates with integrated thermal and mechanical properties. These composite structures provide both the mechanical strength needed for close packing and the protection required to prevent fragility-related failures.
3Strength
If sidewall fins are added to provide structural support and heat dissipation, then rigidity and thermal management are improved, but device complexity increases
Solution Approach 1:
The sidewall fins are designed to perform multiple functions simultaneously: providing structural rigidity to the package, dissipating heat from modules, and serving as thermal pathways. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving improved rigidity and thermal management.
Solution Approach 2:
The patent merges the structural support function and heat dissipation function into a single integrated sidewall fin structure. Rather than adding separate support elements and separate cooling elements, the design combines these functions, reducing overall structural complexity while achieving both rigidity and thermal management goals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the rigidity of the circuit package, effectively dissipates heat, and allows for easy module replacement while maintaining a compact form factor, addressing overheating and mechanical fragility issues.
Implementation Method 1
uses a mounting plate with thermally conductive materials to dissipate heat
Implementation Method 2
incorporates a plurality of sidewall fins that form an interleaving stacked relationship with modules, providing structural support and heat dissipation pathways
Data Source
AI summary
A circuit package for electrically connecting a plurality of modules. The circuit package having a first and second mounting plate, each including a plurality of module connectors configured to receive and form electrical connections with the plurality of modules. The circuit package also having a first and second sidewall mounted to the first and second mounting plates. The first sidewall including a plurality of sidewall fins extending outward from the first sidewall so that the plurality of sidewall fins are positioned between the first and second mounting plates and at least partially interleave with the plurality of modules.