Bidirectional Server Liquid Cooling Connector
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Solution Overview
Problem
Existing liquid cooling systems for high-density servers face challenges with limited space and the inability to handle bidirectional fluid flow, leading to inefficiencies in thermal management and potential fluid leakage.
Innovation Solution
A bidirectional connector assembly that encloses two tubing structures, allowing for simultaneous supply and return of cooling fluid in opposite directions, with a dripless design to prevent leakage and support flexible configurations for high-density server cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single tubing structure is used for liquid cooling, then the connector design is simple, but it cannot handle bidirectional fluid flow for simultaneous supply and return
Solution Approach 1:
The patent implements a nested tubing configuration where an inner tubing structure is positioned within an outer tubing structure. The inner tubing carries fluid in one direction while the outer tubing carries fluid in the opposite direction, enabling bidirectional flow capability within a single connector assembly. This nesting approach allows the connector to handle both supply and return flows simultaneously without requiring separate connectors.
2Volume of moving object
If tubing structures are placed close together to save space, then space utilization improves, but fluid leakage risk increases
Solution Approach 1:
By nesting the inner tubing within the outer tubing, the patent achieves compact space utilization while maintaining reliable fluid containment. The nested configuration naturally separates the two fluid streams, with the inner tubing's fluid flow enclosed by the outer tubing structure, preventing cross-contamination and leakage between the bidirectional flows.
Solution Approach 2:
The patent introduces a support structure positioned between the inner and outer tubing that acts as an intermediary element. This support structure maintains proper spacing and structural integrity between the two tubing structures, preventing direct contact that could lead to leakage while preserving the compact nested configuration.
3Temperature
If air cooling is used for high-density servers, then the system is simple, but thermal management becomes insufficient
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by implementing a connector assembly that facilitates hydraulic fluid flow through nested tubing structures. The liquid cooling system provides superior thermal management efficiency for high-density servers by using liquid coolant to absorb and remove heat more effectively than air cooling, with the connector enabling bidirectional fluid circulation.
4Temperature
If CRAC unit is upgraded to cool high-density racks, then cooling capacity improves, but energy consumption increases significantly
Solution Approach 1:
The patent implements liquid cooling with bidirectional fluid flow through the nested tubing connector, which provides more efficient heat transfer compared to air cooling systems. This hydraulic cooling approach reduces the energy consumption required for thermal management by using liquid coolant circulation instead of high-power CRAC units, achieving superior cooling capacity with lower energy input.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management efficiency, reduces energy consumption, and provides a reliable, flexible solution for high-density server cooling by enabling efficient bidirectional fluid flow and minimizing fluid leakage, suitable for hyperscale and edge computing environments.
Implementation Method 1
A cooling plate is to be attached to an electronic device and a bidirectional connector is to circulate cooling fluid to the cooling plate
Implementation Method 2
Liquid cooling allows for higher packaging density and increased computing load of electronics, by transferring greater thermal energy from the electronic equipment
Data Source
AI summary
According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.