Bifurcated Flex Circuit Board for Direct Motherboard Mounting

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Solution Overview

Problem

Existing flex circuit connection methods face challenges in reducing size and complexity while maintaining reliability and cost-effectiveness, especially as the number of connections increases and mechanical forces are applied, leading to issues with cost and reliability.

Innovation Solution

A multilayer flexible circuit board with bifurcated extensions and electrode pads that can be aligned with motherboard contacts for secure, mechanically flexible connections, allowing for direct mounting without additional packaging, using techniques like soldering, anisotropic conductive adhesives, or clamping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If traditional socket and plug connection methods are used for flex circuits, then electrical connections can be established, but the system size and complexity increase due to additional packaging requirements

Engineering Contradiction:
Improvesystem complexityVSAvoidconnection reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent extracts and eliminates the separate socket component from the connection system. The flex circuit is designed with contact pads that directly interface with the motherboard, removing the intermediate socket and plug elements. This extraction reduces system complexity and packaging requirements while maintaining reliable electrical connections through direct mounting.

Inventive Principle:
Principle #2Taking out (Extraction)

2Productivity

If the number of connection lines increases with smaller pitch, then more data can be transmitted, but manufacturing cost and reliability suffer

Engineering Contradiction:
Improvedata transmission capacityVSAvoidconnection reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The connection interface is segmented into multiple individual contact pads arranged in parallel rows on the flex circuit. Each contact pad corresponds to a specific signal line, allowing independent manufacturing and assembly. This segmentation enables high-density connections with small pitch while maintaining reliability through modular contact structures that can be precisely aligned and soldered to the motherboard.

Inventive Principle:
Principle #1Segmentation

3Strength

If rigid circuit boards are used to strengthen connectors, then mechanical strength improves, but flexibility and ease of location in confined spaces is reduced

Engineering Contradiction:
Improveconnector strengthVSAvoidflexibility
Core Design Contradiction:
StrengthVSEase of operation

Solution Approach 1:

The circuit board exhibits local quality by being rigid in the region of the contact pads and connection interface, while remaining flexible in the trailing section. This is achieved through a rigid-flex construction where a rigid substrate provides structural support and precise contact pad positioning, while a flexible circuit extension allows the connector to be routed into confined spaces and accommodates mechanical movement without compromising connection strength.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS8837141B2Electronic module with heat spreading enclosure
Publication Date: 2014.09.16 MICROELECTRONICS ASSEMBLY TECHNOLOGIES INC
  • US8837141B2 patent drawing
  • US8837141B2 patent drawing
  • US8837141B2 patent drawing

AI summary

An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.