Printed Circuit Assembling TRIZ Cases

Heat pipes conduct energy from a heater block to melt the thermal interface material, reducing temperature differences across the gap.

Wet blast treatment planarizes thick conductor layers on LED mounting substrates to enable uniform Ni/Au plating coverage.

A manufacturing method attaches components to an unpatterned conductor layer using insulating material, creating contact openings for metallization.

Conformal circuit boards mount electronics on spherical lenses, resolving manufacturing complexity from non-planar surfaces.

A sintered cermet conducting element creates a hermetically sealed electrical bushing for implantable medical device housings.

Lateral surface-mount pads eliminate bulky connectors to increase usable layout area and signal frequency.

A barrier maintains constant contact between a hybrid LGA socket and substrate during surface mount assembly.

A three-layer coating system uses a UV-breakable adhesive to enable non-abrasive removal of protective layers from electrical components.

Continuous conductive fluid application along metal wiring extends beyond component edges to distribute mechanical stress during electronic component mounting.

A rod member moves a back edge stopper from the front to secure masks without leaving the work position.

Flip-chip bonding fixes an optical engine to a printed circuit board, managing heat dissipation and signal integrity.

A bifurcated multilayer circuit board aligns electrode pads with motherboard contacts to create a secure, mechanically flexible connection.

A resin board supports printed boards and short bars in motor driving devices.

Softening the adhesive through integrated heating eliminates peeling steps, improving picking reliability and manufacturing efficiency.

Direct-write variable impedance patterning controls resistance values through energy density modulation, eliminating complex geometric trace adjustments.

An aluminum nitride substrate spreads heat laterally across the x-y plane, resolving space occupation conflicts caused by vertical thermal vias.

A metal core solder ball with nickel and tin plating layers transfers heat from semiconductor devices to substrates without affecting electronic elements.

A conformal electromagnetic shield applies a conductive layer to an electronic module surface using electroless plating or epoxy.

Relocating ground electrodes via extraction and dimensional changes reduces stray capacitance, enabling thinner devices with higher design flexibility.

Gravity and vacuum draw solder paste into plated through holes to bond pins, eliminating labor-intensive rework that damages components.

Elastic retention tabs accommodate thermal expansion of printed circuit boards, preventing bowing and maintaining LED performance.

Spring contacts engage the objective lens interface only after adhesive curing, preserving focal position stability during assembly.

Vertical and side abutment portions in the terminal mold portion align connection terminals, reducing projected area by eliminating wiring space.

Segmented heating zones enable late component attachment on a reflow grid array without disturbing existing solder joints.

A printed circuit board uses recessed conductive layers to vary track dimensions while holding system impedance constant.

Compression spring contacts reduce coupling component height and eliminate motherboard cut-outs while supporting multiple independent memory channels.

A column-shaped LED module uses laminated metal plates to dissipate heat from centrally mounted devices.

Progressive pad spacing creates angled solder columns that reduce column tilt variations during thermal cycling, extending fatigue life.

A resin composition with cross-linked polymer particles provides excellent tack property and flexibility.

Flexible printed circuit harness connector joins circuits via bonded pins, reducing assembly complexity and weight in gas turbine engines.

External electrodes with conductive resin layers absorb thermal stress in multilayer ceramic capacitors, preventing crack generation on copper plates.

Capacitively coupled conductors on a flexible plastic film replace separate connectors, reducing manufacturing costs while maintaining transparency.

A temperature measuring apparatus integrates a heat transfer element and detection device onto a wiring board for direct signal transmission.

Thermoplastic adhesive layers bond heated chips to printed conductive surfaces through combined thermal and mechanical pressure.

A bezel structure uses transparent conductive edge-routing wires and photoresist layers to electrically connect metal leads through jumper holes.

An electronic component mounting system deposits additional solder at predetermined electrode positions to ensure adequate material volume.

Alternating high and low permeability segments in a sintered magnetic core reduce thermal losses and leakage fluxes while maintaining compact volume.

A printed circuit board contact plate uses a suppressing portion to block solder flux adhesion on spring contacts.

A stacked electrical connection interface uses overlapping ground planes to shield signal lines and maintain impedance matching.

A flexible printed circuit uses a patterned coverlay to form a planar surface for attached components.

Exposed metal pins in a high-frequency component reduce resistance variability caused by stacking deviations in multilayer substrates.

A coil component uses varying turn separation distances to adjust electromagnetic coupling between adjacent windings.

A flexible substrate integrates electronic and optical components, enabling high-volume production while reducing assembly complexity.

A single motor drives dual shafts through a link mechanism to control squeegee orientation, resolving complexity trade-offs in precision printing.

Projections on through hole walls secure components without temporary tapes, preventing adhesive residue that causes insulation layer warping.

Concave joint spaces confine solder volume to prevent creep into hollow holes, ensuring adequate joining strength while maintaining proper press-fitting precision.

Cutout portions between connection land portions enable direct conductive joining of printed boards while accommodating differential thermal expansion.

Compressed air acts on the lower surface of a SiP module to separate it from double-sided tape, preventing welding pad damage during sputtering.