Integrated Electro-Optical Module Assembly on Flexible Substrate
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Solution Overview
Problem
The challenge lies in efficiently fabricating integrated electro-optical module assemblies in high volume production, as existing methods struggle to accommodate the different form factors and processing requirements of electronic components, micro-energy sources, and optical lenses.
Innovation Solution
A method involving a flexible substrate with integrated electronic and optical components, where a frame with openings is used to expose and affix components, followed by laser cutting to form pre-assemblies, and finally, micro-energy sources are added, allowing for efficient batch production of electro-optical modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If various complex components (semiconductor die, photodiode/LED, micro-energy source, optical lens) are assembled separately to form electro-optical modules, then the module functionality and reliability are improved, but the device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent merges multiple separate components (semiconductor die, photodiode/LED, micro-energy source, optical lens, and circuit board) into a single integrated electro-optical module. The circuit board serves as a common substrate that electrically and mechanically connects all components, eliminating the need for separate assembly steps and reducing overall system complexity while maintaining full functionality.
Solution Approach 2:
The circuit board performs multiple functions simultaneously: it provides mechanical support for all components, establishes electrical connections between components through conductive traces, provides mounting surfaces for the semiconductor die and optical lens, and serves as the structural foundation for the entire module. This multi-functionality reduces the number of separate parts needed.
2Adaptability or versatility
If electronic components, micro-energy sources, and optical lenses with different form factors are assembled separately, then each component can be optimized for its specific function, but the manufacturing process becomes difficult to standardize for high volume production
Solution Approach 1:
The circuit board is designed as a universal platform that can accommodate various component types and form factors through standardized mounting techniques. Different components (semiconductor die, photodiode/LED, optical lens) can be mounted on the same board using conventional methods, enabling standardized batch manufacturing processes while maintaining component-specific optimization.
Solution Approach 2:
The module is segmented into distinct functional areas on the circuit board, with each component mounted in its optimized position. The circuit board is divided into regions for electronic components, optical components, and interconnections, allowing each component to be independently optimized while maintaining a standardized overall manufacturing process.
3Manufacturing precision
If a frame with openings is used to expose and affix components during assembly, then component alignment and integration are improved, but the additional manufacturing steps and time required increase
Solution Approach 1:
The circuit board is prepared in advance with pre-defined mounting areas, conductive traces, and structural features that guide component placement. This preliminary preparation eliminates the need for complex alignment frames during assembly, as components can be directly positioned and affixed to their predetermined locations on the board, maintaining precision while reducing assembly time.
Data Source
AI summary
An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.