LED Module with Column-Shaped Mounting Substrate for Wide Light Distribution

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Solution Overview

Problem

Existing LED lamps with wide light distribution often have complex structures and increased manufacturing burdens due to the use of multiple optical members, large numbers of LED devices, and complicated assembly processes, especially when the light source is positioned near the center of the globe.

Innovation Solution

An LED module with a column-shaped mounting substrate, comprising a first and second metal plate laminated with an insulation layer, where LED devices are mounted at the leading end, reducing the number of light-blocking members and enabling wide light distribution with a simple structure, and a thermally conductive part for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If optical members such as reflectors and prisms are arranged within the globe to widen light distribution, then light distribution is improved, but device complexity increases

Engineering Contradiction:
Improvelight distributionVSAvoidstructure complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates optical members (reflectors, prisms) from the globe interior, replacing them with LED devices strategically arranged near the center of the globe. This removal of unnecessary components simplifies the structure while maintaining wide light distribution through direct emission from centrally positioned LED devices.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent transitions from arranging LED devices on the periphery (2D surface arrangement) to positioning them at the center (3D volumetric arrangement). This dimensional change allows light to radiate in all directions uniformly without requiring optical members, achieving wide light distribution with simpler structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If a large number of LED devices are arranged three-dimensionally within the globe to achieve wide light distribution, then light distribution is improved, but device complexity increases

Engineering Contradiction:
Improvelight distributionVSAvoidassembly complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

Instead of arranging a large number of LED devices throughout the globe, the patent uses a small number (3-9) positioned at the center. This partial action approach achieves sufficient wide light distribution without the complexity of managing numerous devices, proving that excessive arrangement is unnecessary.

Inventive Principle:
Principle #16Partial or excessive action

Solution Approach 2:

The patent merges multiple functions into the central LED devices: they serve as both the light source and the structural element for achieving wide distribution. By combining the light-emitting function with the spatial positioning function, the design eliminates the need for separate optical members and complex assembly structures.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If LED devices are arranged on the periphery of the globe, then manufacturing is simplified, but light distribution is reduced due to blocking by mounting substrates

Engineering Contradiction:
Improvemounting simplicityVSAvoidlight distribution
Core Design Contradiction:
Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent inverts the conventional peripheral arrangement by positioning LED devices at the center of the globe. This inversion eliminates the blocking problem caused by peripheral mounting substrates, as central positioning allows light to radiate outward in all directions without obstruction, achieving both wide distribution and simplified manufacturing.

Inventive Principle:
Principle #13The other way round (Inversion)

4Device complexity

If the number of LED devices is reduced to a small number, then device complexity is reduced, but heat dissipation becomes more challenging

Engineering Contradiction:
Improvestructure simplicityVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent introduces a heat dissipation member as an intermediary between the LED devices and the external environment. This mediator efficiently conducts heat away from the centrally positioned LED devices, solving the heat dissipation challenge that arises from using a small number of devices while maintaining structural simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The LED module achieves wide light distribution with a small number of LED devices and a simple assembly process, while providing excellent heat dissipation efficiency by using a column-shaped mounting substrate and thermally conductive materials.

Implementation Method 1

a column-shaped mounting substrate 11... an LED module 10 which has excellent heat dissipation efficiency

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an LED element in which the LED die is coated with a fluorescent resin and electrodes for mounting are formed is referred to as an LED device

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Data Source

PatentUS9360167B2LED module and LED lamp employing same
Publication Date: 2016.06.07 CITIZEN ELECTRONICS CO LTD

AI summary

Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.