Wiring Substrate Through Hole Projections for Component Fixation
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Solution Overview
Problem
The existing manufacturing process for wiring substrates often results in residual adhesive agent from temporary tapes causing warping or defoliation of the insulation layer, leading to defective substrates due to rigid pressure application during insulation layer formation.
Innovation Solution
Incorporating projections on the walls of the through hole that support the electronic component, eliminating the need for temporary tapes and preventing adhesive residue, while forming engagement grooves to secure the component without applying stress that could damage it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a tape is temporarily fastened to the substrate core to seal the through hole during insulation layer formation, then the electronic component can be arranged in the through hole, but the adhesive agent of the tape remains on the substrate core after removal causing warping or defoliation
Solution Approach 1:
The patent removes the tape sealing step entirely from the manufacturing process. Instead of using a tape to seal the through hole and then removing it, the design directly forms the insulation layer over the electronic component arranged in the through hole, extracting the harmful tape removal step that causes adhesive residue and substrate warping.
Solution Approach 2:
The patent eliminates the use of disposable tape that leaves harmful residue. By designing the through hole with a smaller diameter than the electronic component body, the component itself acts as a permanent seal, replacing the temporary disposable tape that causes reliability issues.
2Ease of operation
If the through hole diameter is made larger than the electronic component to facilitate arrangement, then the component can be easily inserted, but the component becomes loose and requires additional fixing measures
Solution Approach 1:
The patent applies local quality by making the through hole diameter smaller than the electronic component body dimensions. This creates a tight fit where the component is locally constrained within the through hole, providing stable fixation without requiring additional fixing measures while still allowing for practical insertion.
Solution Approach 2:
The patent utilizes asymmetry between the through hole diameter and the electronic component body dimensions. The through hole is designed with a diameter smaller than the component body, creating an asymmetric fit that provides mechanical interference and stable fixation while maintaining ease of insertion through the asymmetric geometry.
Data Source
AI summary
A wiring substrate is provided with a substrate core including a first main surface, a second main surface, and a through hole. An electronic component is arranged in the through hole. A projection projects from a wall of the through hole toward a connection terminal of the electronic component. An insulator is filled between the wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body. The connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.