Lateral Surface-Mount Pads for Circuit Module Interconnect
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Solution Overview
Problem
Conventional connectors used to connect circuit modules to circuit boards occupy significant space, block usable layout areas, and degrade electrical performance by requiring lower signal frequencies for reliable operation.
Innovation Solution
The use of surface-mounting pads on the lateral surface of circuit modules to connect with corresponding pads on circuit boards, eliminating the need for through-hole pins and conventional connectors, thereby reducing space requirements and enhancing electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connectors are used to connect circuit modules to circuit boards, then reliable electrical connection is achieved, but connecting space increases and usable layout area decreases
Solution Approach 1:
The patent extracts the connection function from traditional through-hole connectors and relocates it to the lateral surface of the circuit module. Surface-mount pads are created on the lateral surface through through-hole vias or embedded vias, allowing the circuit module to connect to the circuit board without occupying valuable top or bottom layout areas. This extraction principle resolves the contradiction by separating the connection function from the main mounting surfaces.
Solution Approach 2:
The patent transitions the connection interface from the traditional planar dimension (top or bottom surface) to a lateral dimension. By placing surface-mount pads on the lateral surface of the circuit module, the connection is established in a different spatial dimension, effectively utilizing the side surface area that would otherwise be unused. This dimensional change allows reliable electrical connection while preserving the usable layout area on the top and bottom surfaces.
2Reliability
If conventional connectors with through-hole pins are used, then electrical connection is established, but connecting space and component mounting space are blocked
Solution Approach 1:
The patent extracts the connection function from bulky through-hole connectors and implements it through compact surface-mount pads on the lateral surface. The through-hole vias or embedded vias provide the necessary electrical connection without requiring large connector housings or multiple through-hole pins, thereby reducing the overall space occupation while maintaining reliable electrical connection.
Solution Approach 2:
The patent merges the electrical connection function with the lateral surface structure of the circuit module. Instead of using separate connector components that occupy additional space, the connection pads are integrated directly into the lateral surface, combining the module body and connection interface into a unified structure that minimizes space occupation.
3Strength
If connectors are mounted on circuit boards using through-hole pins, then secure mechanical connection is achieved, but usable layout area is blocked
Solution Approach 1:
The patent relocates the mechanical connection interface from the planar dimension (where through-hole pins would block layout area) to the lateral dimension. Surface-mount pads on the lateral surface provide mechanical attachment points that do not interfere with the usable layout area on the top or bottom surfaces, while still achieving secure mechanical connection through the same lateral mounting approach.
Solution Approach 2:
The patent segments the connection function into multiple surface-mount pads distributed on the lateral surface, rather than using a single large connector. This segmentation allows the connection interface to be distributed along the lateral edge, minimizing the impact on usable layout area while providing multiple attachment points for secure mechanical connection.
Data Source
AI summary
A circuit module for connecting to a circuit board is disclosed, the circuit module for connecting to a circuit board, wherein the circuit module comprises a substrate having a top surface, a bottom surface and a lateral surface connecting the top surface and bottom surface, wherein at least one electrical component is disposed on the top or bottom surface and a plurality of surface-mount pads are disposed on the lateral surface of the substrate for electrically connecting to corresponding pads on the circuit board.