Recessed Conductive Layer Circuit Board Impedance Adaptation
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Solution Overview
Problem
Circuit boards face challenges in adapting to components with varying contact areas, leading to impedance mismatches and suboptimal connections due to fixed conductor track dimensions and impedance requirements.
Innovation Solution
The design incorporates recessed conductive layers in the circuit board's layer stack, allowing for varying conductor track sections with different dimensions while maintaining consistent impedance, achieved by adjusting the thickness of insulating layers formed by core layers, enabling adaptation to components with different contact area requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductor track dimensions are fixed to maintain consistent impedance, then the impedance matching is improved, but the adaptability to components with different contact areas deteriorates
Solution Approach 1:
The patent applies local quality by creating different conductor track sections with different dimensions within the same circuit board. The first conductor track section has a first width for components requiring larger contact areas, while the second conductor track section has a second width for components requiring smaller contact areas. This allows each local region to be optimized for its specific component requirements while maintaining overall system functionality.
Solution Approach 2:
The patent changes the dimensional parameters of the conductor track to resolve the contradiction. By varying the width of different conductor track sections, the patent accommodates different contact area requirements while using different insulating layer thicknesses to maintain consistent impedance characteristics across both sections.
2Adaptability or versatility
If the conductor track dimensions are increased to accommodate larger contact areas, then the adaptability to components is improved, but the impedance control deteriorates
Solution Approach 1:
The patent creates specialized regions with different structural characteristics. The first conductor track section is designed with a first insulating layer having a first thickness to accommodate larger contact areas, while the second conductor track section uses a second insulating layer with a second thickness for precise impedance control. This local differentiation allows both large contact area adaptability and precise impedance control to coexist.
Solution Approach 2:
The patent resolves the impedance control issue by transitioning from controlling only the horizontal dimension (conductor track width) to also utilizing the vertical dimension (insulating layer thickness). By varying the thickness of the insulating layer, the patent can maintain consistent impedance even when the conductor track width changes to accommodate different contact area requirements.
3Adaptability or versatility
If different insulating layer thicknesses are used to accommodate different contact areas, then the adaptability is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the insulating layer into multiple distinct layers with different thicknesses. The first insulating layer has a first thickness for regions requiring larger contact areas, while the second insulating layer has a second thickness for regions requiring precise impedance control. This segmentation allows the complex requirement of accommodating different components to be divided into manageable structural units.
Solution Approach 2:
The patent creates a multi-functional layer stack structure where the first insulating layer serves regions requiring larger contact areas and the second insulating layer serves regions requiring precise impedance control. This universal layer stack design can accommodate multiple types of components with different requirements, making the circuit board adaptable to various configurations without requiring completely different designs for each component type.
Data Source
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AI summary
Exemplary embodiments of the present invention provide a printed circuit board comprising a layer stack 100. The layer stack 100 comprises a plurality of core layers 112a; 112b and a plurality of conductive layers 110a; 110b. Each conductive layer of the plurality of conductive layers is electrically conductive. Furthermore, the printed circuit board comprises a conductive track layer 110c arranged on the layer stack, comprising a conductive track 128. The conductive track 128 has a first conductive track section 130 in a first region 120 and a second conductive track section 132 in a second region 122. A recessed conductive layer 110b of the plurality of conductive layers has a recess 140 in the first region 120.