Reflow Grid Array Interposer With Localized Heating Zones
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Solution Overview
Problem
Current computer packaging technologies face challenges in efficiently integrating multiple components near each other, leading to increased complexity, yield loss, and cost due to the need for global heat application and lengthy signal paths, which complicates the late attach, removal, and repair of components in multi-chip packages.
Innovation Solution
A reflow grid array (RGA) interposer with selectively reflowable contacts and embedded heaters allows for custom placement and removal of components without disturbing existing attachments, using local heating to reduce heat transfer and signal interference, and incorporates low-loss dielectric materials to improve signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If global heat application is used for component attachment, then all components can be attached simultaneously, but heat transfer causes unintended reflow of already attached components and increases energy consumption
Solution Approach 1:
The heating system is divided into multiple independently controllable heating zones corresponding to different component locations on the interposer. Each zone can be activated separately to heat only the specific area where a component needs to be attached, avoiding global heat application and preventing unintended reflow of already attached components.
Solution Approach 2:
The patent implements localized heating capability where each heating zone provides thermal energy only to its specific region. This allows precise temperature control at each component location, enabling selective reflow of solder joints without affecting other areas, thus resolving the contradiction between efficient attachment and harmful heat transfer.
2Area of stationary object
If components are placed closer together to increase integration density, then package size is reduced, but signal interference and heat management become more difficult
Solution Approach 1:
The interposer is divided into multiple isolated heating zones with thermal barriers between them. This segmentation allows components to be placed closer together while preventing heat from one component from interfering with adjacent components, enabling high-density packaging without compromising signal integrity or thermal management.
3Ease of manufacture
If traditional packaging methods are used for multi-chip packages, then manufacturing is simplified, but late attach and repair of components is not feasible
Solution Approach 1:
The patent creates a dynamic system where components can be attached or removed on-demand using selective heating zones. The heating zones can be activated individually to facilitate late attach of components or to enable repair by removing and replacing specific components without affecting others, transforming the static packaging into a reconfigurable system.
Solution Approach 2:
The interposer acts as an intermediary substrate between the motherboard and components, providing a platform with selective heating capability. This intermediary enables flexible component attachment and repair operations, serving as a mediator that simplifies manufacturing while enabling future rework and upgrades.
4Adaptability or versatility
If selective heating zones are implemented for component attachment, then late attach and removal become possible, but device complexity increases
Solution Approach 1:
The heating system is segmented into multiple independently controlled zones, each manageable through dedicated control circuitry. This segmentation allows the complex function of selective heating to be broken down into simpler, independent control units, making the overall system more manageable despite the increased functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RGA interposer enables cost-effective, modular, and configurable component integration with improved signal integrity and reduced yield loss, allowing for late attach and removal of components, thereby enhancing the performance and flexibility of computer systems.
Implementation Method 1
heating elements to heat the second connection pads
Implementation Method 2
using local heating to reduce heat transfer
Data Source
AI summary
A reflowable grid array (RGA) interposer includes first connection pads on a first surface of a body and second connection pads on a second surface of the body. Heating elements within the body are adjacent to the second connection pads. First interconnects within the body connect some of the second connection pads to the first connection pads. Second interconnects within the body connect pairs of the second connection pads. A motherboard assembly includes first and second components (e.g., CPU with co-processor and/or memory) and the RGA interposer. The first connection pads are in contact with motherboard contacts. The second connection pads are in contact with the first and second components. The first component passes signals directly to the motherboard by the first interconnects. The second component passes signals directly to the first component by the second interconnects but does not pass signals directly to the motherboard by the first interconnects.