Thermal Interface Material Phase Change for PCB Heat Dissipation

Solution Overview

Problem

Current thermal solutions for high-power integrated circuits face challenges with thermal resistance in thermal interface materials, particularly for processors exceeding 200 W, where temperature differences across these materials can vary significantly, and existing methods are costly and limited by keep-out zones on printed circuit boards.

Innovation Solution

A thermal interface system that includes a heat sink with a base accommodating heat pipes and a heater block, where the heat pipes conduct heat to the thermal interface material, allowing it to spread evenly between the heat sink and the PCB, reducing thermal resistance and enabling efficient heat dissipation without requiring full system heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a thermal interface material is used between the processor and heat sink, then thermal coupling is achieved, but thermal resistance increases causing temperature difference of 10-12 degrees Celsius

Engineering Contradiction:

Improvethermal couplingVSAvoidtemperature difference across TIM

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent changes the physical state of the thermal interface material from solid to liquid by heating it above its melting point. This phase change allows the material to flow and fill gaps between surfaces, then solidifies to create a strong thermal bond, thereby reducing thermal resistance while maintaining reliable thermal coupling.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the phase transition of the thermal interface material between solid and liquid states. By heating the TIM to melt it, the material becomes fluid and can spread evenly to fill voids and irregularities. Upon cooling, it solidifies to form a continuous thermal path, effectively reducing the temperature difference across the interface.

Inventive Principle:

Principle #36Phase transitions

2Productivity

If the processor temperature is reduced by one degree, then processor performance increases significantly, but achieving this requires overcoming the thermal resistance of the TIM

Engineering Contradiction:

Improveprocessor performanceVSAvoidprocessor temperature reduction

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent changes the physical state of the thermal interface material from solid to liquid by heating it above its melting point. This phase change allows the material to flow and fill gaps between surfaces, then solidifies to create a strong thermal bond, thereby reducing thermal resistance while maintaining reliable thermal coupling.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the phase transition of the thermal interface material between solid and liquid states. By heating the TIM to melt it, the material becomes fluid and can spread evenly to fill voids and irregularities. Upon cooling, it solidifies to form a continuous thermal path, effectively reducing the temperature difference across the interface.

Inventive Principle:

Principle #36Phase transitions

3Power

If conventional thermal solutions are used for high-power processors exceeding 200 W, then heat dissipation is attempted, but thermal resistance and temperature differences become problematic

Engineering Contradiction:

Improveprocessor power handlingVSAvoidthermal management effectiveness

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

The patent changes the physical state of the thermal interface material from solid to liquid by heating it above its melting point. This phase change allows the material to flow and fill gaps between surfaces, then solidifies to create a strong thermal bond, thereby reducing thermal resistance while maintaining reliable thermal coupling.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes the phase transition of the thermal interface material between solid and liquid states. By heating the TIM to melt it, the material becomes fluid and can spread evenly to fill voids and irregularities. Upon cooling, it solidifies to form a continuous thermal path, effectively reducing the temperature difference across the interface.

Inventive Principle:

Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution decreases thermal resistance, increases processor performance, and allows for reliable junction temperature management within existing boundary conditions, while being cost-effective and suitable for multi-IHS structures and bare die configurations.

Implementation Method 1

a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Data Source

PatentUS10074591B1System with provision of a thermal interface to a printed circuit board

Publication Date: 2018.09.11 INTEL CORP

AI summary

Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.