Conductive Fluid Application for Metal Wiring Stress Distribution
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Solution Overview
Problem
Existing electrical circuit formation methods face challenges in ensuring reliable conduction of metal wiring when an electronic component is mounted with an electrode in contact with a conductive fluid applied onto the metal wiring, and a coating body is formed with a curable resin.
Innovation Solution
The method involves forming a metal wiring on a resin layer, applying a conductive fluid continuously along the direction of the metal wiring from the planned mounting position of the electrode to a position beyond the outer edge of the electronic component, mounting the electronic component such that its electrode contacts the conductive fluid, and forming a coating body with a curable resin to cover the periphery of the electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conductive fluid is applied only at the planned mounting position of the electrode, then the mounting process is simple, but the metal wiring experiences high force and may crack
Solution Approach 1:
The conductive fluid is applied in advance along the entire direction of the metal wiring before mounting the electronic component. This preliminary application of conductive fluid creates a stress-distributing pathway that prevents wiring crack during subsequent mounting operations, resolving the contradiction between simple mounting process and wiring strength
Solution Approach 2:
The patent changes the spatial distribution parameter of the conductive fluid from a point application (only at electrode mounting position) to a linear application (along the entire wiring direction). This parameter change allows the conductive fluid to distribute mechanical stress along the wiring, preventing crack while maintaining mounting simplicity
2Reliability
If the conductive fluid is applied continuously along the metal wiring direction, then the metal wiring conduction is ensured and cracking is prevented, but the amount of conductive fluid used increases
Solution Approach 1:
The conductive fluid is applied with different characteristics at different locations along the wiring. The fluid is applied continuously along the wiring direction to ensure conduction and prevent crack, while the amount used is optimized to maintain reliability without excessive consumption. This local quality approach ensures conduction reliability while controlling material usage
3Stress or pressure
If the conductive fluid is applied beyond the outer edge of the electronic component, then the stress distribution on metal wiring is improved, but the precision of electrode alignment may be affected
Solution Approach 1:
The conductive fluid is applied in advance along the wiring direction with its end extending beyond the electronic component outer edge. This preliminary action creates a stress-distributing pathway that extends beyond the component boundaries, allowing stress to be distributed more evenly along the wiring while the electrode alignment precision is maintained through the planned mounting position marking
Solution Approach 2:
The conductive fluid serves as an intermediary material that transfers and distributes mechanical stress along the wiring. By applying the fluid beyond the component edge, it creates a stress-distributing intermediary pathway that protects the wiring from crack while the electrode alignment is controlled by the planned mounting position, resolving the contradiction between stress distribution and alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the force applied to the metal wiring, ensuring appropriate conduction and preventing cracking of the wiring by distributing stress effectively through the use of a conductive resin paste with a low Young's modulus.
Implementation Method 1
the conductive fluid is applied continuously in a direction in which the metal wiring extends, from a planned mounting position of the electrode to a position that extends out of an outer edge of the electronic component... reduce the force applied to the metal wiring located below the portion in contact with the electronic component and the coating body
Implementation Method 2
a coating body is formed with a curable resin so as to cover the periphery of the electronic component
Data Source
AI summary
An electrical circuit formation method including a wiring forming step of forming a metal wiring on a resin layer, an applying step of applying a conductive fluid on the metal wiring, a mounting step of mounting an electronic component such that an electrode comes into contact with the conductive fluid applied in the applying step, and a coating body forming step of forming a coating body with a curable resin to cover a periphery of the electronic component mounted in the mounting step, in which in the applying step, the conductive fluid is applied continuously in a direction in which the metal wiring extends, from a planned mounting position of the electrode to a position that extends out of an outer edge of the electronic component.