Connection Terminal Unit with Abutment Portions for Semiconductor Modules
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Solution Overview
Problem
Existing connection terminal units for semiconductor modules require significant space due to the need for wiring, hindering the downsizing of semiconductor modules.
Innovation Solution
A connection terminal unit with a terminal mold portion that includes vertical and side abutment portions to accurately align and connect connection terminals with terminal connection portions without the need for wiring, reducing the projected area by defining positions from three directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to connect signal terminals and semiconductor elements, then connection reliability is improved, but the projected area increases due to required wiring space
Solution Approach 1:
The invention extracts and eliminates the bonding wire from the connection system, replacing it with a direct face-to-face connection between connection terminals and terminal connection portions. This removes the need for wiring space while maintaining connection reliability through precise positioning enabled by the abutment portion structure.
Solution Approach 2:
The invention transitions from a planar wiring approach to a three-dimensional positioning approach using the abutment portion with vertical and side surfaces. By defining relative positions in multiple dimensions (vertical direction and lateral directions), the connection is achieved without requiring additional projected area for wiring paths.
2Device complexity
If connection terminals are positioned without precise alignment structures, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The abutment portion structure enables self-alignment between the connection terminal unit and semiconductor module. The vertical and side surfaces automatically define the relative position during assembly, eliminating the need for complex external alignment mechanisms while ensuring high manufacturing precision.
Solution Approach 2:
The abutment portion is pre-formed on the terminal mold portion with specific geometric features (vertical and side surfaces) that predetermined the alignment position. This preliminary positioning structure ensures that when components are assembled, the connection terminals automatically face the terminal connection portions with the required precision.
Data Source
AI summary
A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. Connection terminal unit includes plurality of connection terminals facing and connected to plurality of terminal connection portions of semiconductor module, and terminal mold portion holding connection terminals. Terminal mold portion has abutment portion that abuts against semiconductor module or base material holding semiconductor module. Abutment portion has vertical abutment portion that abuts against semiconductor module or base material from vertical direction that is a direction in which connection terminals face terminal connection portions, and side abutment portion that abuts against semiconductor module or base material from at least two directions that are different from each other and intersect with vertical direction.