Concave Joint Space for Solder Control in Semiconductor Devices
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Solution Overview
Problem
The reliability of semiconductor devices is compromised due to reduced joining strength between conductive patterns and contact components caused by insufficient solder thickness, and excessive solder can creep into hollow holes, leading to improper press-fitting and potential damage to other components.
Innovation Solution
A semiconductor device design featuring a substrate with concave joint spaces in the conductive patterns and cylindrical contact components with hollow holes, where the contact components are joined to the conductive patterns using a controlled amount of solder within these spaces, preventing solder spread and ensuring adequate joining strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the amount of solder is increased to improve joining strength, then the joining strength between contact components and conductive patterns is improved, but the solder creeps into hollow holes of contact components causing improper press-fitting
Solution Approach 1:
The conductive pattern is designed with a localized concave joint space at the specific location where the contact component is mounted. This local structural modification creates a solder reservoir that confines the solder to the desired area, allowing sufficient solder volume for strong joining while preventing solder from creeping into the hollow hole of the contact component.
Solution Approach 2:
The concave joint space acts as an intermediary structure between the conductive pattern and the contact component. It serves as a buffer zone that holds the solder, mediating the joining process by containing the solder within the joint space and preventing it from entering the contact component's hollow hole, thus enabling both strong joining and proper press-fitting.
2Strength
If the amount of solder is increased to improve joining strength, then the joining strength between contact components and conductive patterns is improved, but the solder spreads over and wets non-target areas on the substrate
Solution Approach 1:
The conductive pattern is designed with a localized concave joint space at the specific location where the contact component is mounted. This local structural modification creates a solder reservoir that confines the solder to the desired area, allowing sufficient solder volume for strong joining while preventing solder from creeping into the hollow hole of the contact component.
Solution Approach 2:
The concave joint space acts as an intermediary structure between the conductive pattern and the contact component. It serves as a buffer zone that holds the solder, mediating the joining process by containing the solder within the joint space and preventing it from entering the contact component's hollow hole, thus enabling both strong joining and proper press-fitting.
3Strength
If the solder thickness is increased to improve joining strength, then the joining strength between contact components and conductive patterns is improved, but the reliability of the semiconductor device is reduced due to solder creeping into hollow holes
Solution Approach 1:
The conductive pattern is designed with a localized concave joint space at the specific location where the contact component is mounted. This local structural modification creates a solder reservoir that confines the solder to the desired area, allowing sufficient solder volume for strong joining while preventing solder from creeping into the hollow hole of the contact component.
Solution Approach 2:
The concave joint space acts as an intermediary structure between the conductive pattern and the contact component. It serves as a buffer zone that holds the solder, mediating the joining process by containing the solder within the joint space and preventing it from entering the contact component's hollow hole, thus enabling both strong joining and proper press-fitting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the joining strength between contact components and conductive patterns, prevents solder creep, and maintains a controlled solder thickness, thereby improving the reliability and manufacturing efficiency of semiconductor devices.
Implementation Method 1
The contact components are joined to the conductive patterns using a controlled amount of solder within these spaces
Data Source
AI summary
After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.