Circuit Board Component Metallization via Insulated Conductor Layer
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Solution Overview
Problem
Existing methods for manufacturing circuit-board layers with high-quality electrical contacts are inadequate due to poor electrical properties of contacts made with electrically conductive adhesives, which are not suitable for critical applications.
Innovation Solution
The method involves attaching components to an unpatterned conductor layer using an insulating material, creating contact openings, and forming conductor material within these openings through chemical or electrochemical metallization, followed by patterning the conductor layer and creating vias for reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrically conductive adhesive is used to attach components to conductor patterns, then the manufacturing process is simplified, but the electrical properties of the contacts deteriorate
Solution Approach 1:
The contact structure is segmented into multiple functional layers: insulating material for mechanical attachment, conductor layer for electrical connection, and conductor material filled in contact openings for optimized electrical contact. This segmentation allows each layer to perform its specific function optimally, achieving both ease of manufacture and high electrical properties.
Solution Approach 2:
An insulating material is introduced as an intermediary between the component and the conductor layer. This intermediary enables mechanical attachment while allowing separate optimization of electrical contact through dedicated contact openings and metallization processes, resolving the contradiction between manufacturing simplicity and electrical performance.
2Reliability
If contact openings are opened and conductor material is formed through chemical and/or electrochemical metallization, then the electrical properties of contacts are improved, but the manufacturing complexity increases
Solution Approach 1:
Contact openings are opened and prepared with conductor material through chemical and/or electrochemical metallization before the final conductor layer patterning. This preliminary action ensures high-quality electrical contacts are established early, and subsequent steps build upon this foundation, making the overall complex process more manageable and systematic.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of high-quality, reliable electrical contacts with improved electrical properties, suitable for critical applications, by using microvia methods and ensuring precise alignment and metallization of contact areas.
Implementation Method 1
a conductor material is formed in the contact openings. The conductor material is manufactured preferably using a chemical and/or electrochemical metallization method
Implementation Method 2
a conductor material is formed in the contact openings. The conductor material is manufactured preferably using a chemical and/or electrochemical metallization method
Data Source
AI summary
A method for manufacturing a circuit-board layer on a base surface (2), which base surface (2) includes conductor patterns (19). The circuit-board layer being manufactured comprises a conductor-pattern layer (14), an insulating layer (1), and at least one component (6) inside the insulating-material layer (1). According to the invention, the component (6) is attached to the conductor layer (4), the conductor layer (4) is aligned relative to the base surface (2) attached with the aid of an insulating material (1) to the base surface (2). An insulating-material layer (1) is thus formed between the conductor layer (4) and the base surface (2), on which the said at least one component (6) is located. Electrical contacts are formed between the contact areas (7) of the component (6) and the conductor layer (4), in such a way that contact openings (17) are opened at the positions of the contact areas (7) of the component (6) and conductive material is made in the contact openings (17). The conductor layer (4) is patterned to form a conductor-pattern layer (14), and at least one via (20) is made between the conductor-pattern layer (14) and the conductor patterns (19) of the base surface (2).