SiP Module Pickup Using Compressed Air Loosening
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Solution Overview
Problem
The existing methods for manufacturing SIP modules with EMI electromagnetic shielding layers are complex and inefficient, particularly in preventing pollution and damage to welding pads during the sputtering process, which is not suitable for mass production.
Innovation Solution
A pickup method and equipment that uses compressed air to loosen the bonding between the SIP module and the doubled-sided adhesive tape, allowing for the SIP module to be picked up without pollution or damage, while ensuring the EMI electromagnetic shielding layer is formed effectively without sputtering material reaching the welding pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the existing method of printing INK protective layer before sputtering is used, then the welding pads are protected from pollution and damage, but the operation process becomes complicated and production efficiency decreases
Solution Approach 1:
The patent applies preliminary action by positioning the SiP module vertically with welding pads facing upward before the sputtering process begins. This preliminary positioning ensures that the welding pads are naturally protected from sputtering material deposition without requiring additional protective layers or masking steps, thus maintaining reliability while improving productivity
Solution Approach 2:
The patent extracts and removes the complex INK protective layer application and removal steps from the manufacturing process. By using vertical positioning and controlled sputtering, the method eliminates the need for auxiliary protective materials and their associated processing steps, simplifying the operation process and enhancing production efficiency
2Manufacturing precision
If the sputtering process is performed on horizontally placed SiP modules, then the EMI shielding layer can be formed, but the welding pads are exposed to sputtering material causing pollution and damage
Solution Approach 1:
The patent transitions from horizontal to vertical positioning of the SiP module, changing the spatial dimension of the sputtering process. By orienting the module vertically with welding pads facing upward, the sputtering material deposits only on the upper surface where the EMI shielding layer is needed, while the downward-facing welding pads remain protected from contamination
Solution Approach 2:
The patent applies local quality by directing the sputtering process to affect only specific areas of the SiP module. The vertical positioning ensures that sputtering material is deposited locally on the upper surface to form the EMI shielding layer, while the welding pads on the lower surface are excluded from the sputtering zone, receiving no harmful material deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves the efficiency of SIP module production by preventing pollution and damage to welding pads, ensuring effective EMI shielding while maintaining the integrity of the module, and enabling mass production.
Implementation Method 1
The nozzle sucks the SiP module with suction
Implementation Method 2
Compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened
Implementation Method 3
technicians in the field invent an electromagnetic interference shielding structure of an integrated circuit substrate, directly form block compartments on the integrated circuit substrate by sputtering
Data Source
AI summary
The invention discloses, pickup method, equipment and EMI electromagnetic shielding layer manufacturing method of SiP module. The method for picking up the SiP module comprises the following steps: A nozzle descends to touch the upper surface of the SiP module; the nozzle sucks the SiP module; an air thimble ascends to touch the lower surface of the carrier; the air thimble covers the through hole of the carrier, so as to form the enclosed space for the lower surface of the SiP module, the through hole and the air thimble; compressed air is sprayed into the enclosed space from the hollow structure of the air thimble and acts on the lower surface of the SiP module, so that the bonding between the SiP module and the doubled-sided adhesive tape is loosened; the nozzle ascends and picks up the SiP module.