RFIC Module Bonding via Heated Hot Melt Adhesive
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Solution Overview
Problem
Existing manufacturing methods for wireless communication devices, such as those described in WO '391, face challenges in efficiently and reliably picking up and adhering RFIC modules to antenna base materials due to the need to peel off and pick up RFIC elements from tapes, which is time-consuming and prone to failure.
Innovation Solution
A wireless communication device manufacturing system that includes a mounting apparatus with a suction nozzle to hold the RFIC module, a conveyance apparatus to move the antenna base material to a mounting position, and a heating apparatus to soften the hot melt adhesive layer of the RFIC module, allowing for easy and reliable bonding of the RFIC module to the antenna base material through the hot melt adhesive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If RFIC element with seal is peeled off and picked up from tape, then the RFIC module can be transferred to the antenna base material, but the process takes time and picking up may fail
Solution Approach 1:
The RFIC module is pre-mounted on a carrier tape in advance, allowing the mounting apparatus to directly pick up the entire module (RFIC chip + seal + carrier) as a single unit. This preliminary assembly eliminates the need for separate peeling and picking operations, thereby improving both manufacturing efficiency and picking reliability.
Solution Approach 2:
The carrier tape serves multiple functions: it acts as a protective carrier during storage and transport, provides a standardized interface for automated picking by the mounting apparatus, and facilitates precise positioning on the antenna base material. This multi-functional design streamlines the entire manufacturing process.
2Reliability
If hot melt adhesive layer is heated to soften for bonding, then the RFIC module adheres reliably to the antenna base material, but additional heating equipment and process time are required
Solution Approach 1:
The heating function is integrated into the mounting apparatus itself, combining the picking, positioning, and bonding operations in a single device. The mounting apparatus includes both the suction nozzle for picking up the RFIC module and the heating element for softening the adhesive, eliminating the need for separate heating equipment and reducing system complexity.
Solution Approach 2:
The system controls the temperature parameter of the hot melt adhesive layer by applying heat through the mounting apparatus, transforming the adhesive from a solid state to a softened state that enables reliable bonding. This controlled parameter change ensures consistent bonding quality without requiring complex external heating systems.
3Ease of operation
If suction nozzle is used to hold RFIC module, then the module can be picked up easily, but the RFIC module must be held in a state suitable for suction
Solution Approach 1:
The RFIC module is pre-assembled on the carrier tape with the seal properly positioned, creating a standardized configuration that is optimized for suction pickup. This preliminary arrangement ensures that the suction nozzle can reliably grasp the module without requiring complex adjustment or adaptation for different module types.
Solution Approach 2:
The carrier tape acts as an intermediary between the RFIC chip and the mounting apparatus. The suction nozzle picks up the entire assembly (RFIC chip + seal + carrier tape), and the carrier tape facilitates this interaction by providing a uniform surface and structure that is easy to grasp, while also protecting the delicate RFIC chip during handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient and reliable picking up and adherence of RFIC modules to antenna base materials, improving the manufacturing process by reducing time and failure rates associated with traditional methods.
Implementation Method 1
a heating apparatus configured to heat a hot melt adhesive layer of the RFIC module
Implementation Method 2
bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating
Implementation Method 3
a mounting head mounted with a suction nozzle that sucks and holds a radio-frequency integrated circuit ('RFIC') module
Implementation Method 4
capacitively couples an antenna pattern and a terminal electrode through the hot melt adhesive layer
Data Source
AI summary
A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.