Multilayer Electronic Device Non-Superposing Substrate Region
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer electronic devices face design limitations in reducing thickness and increasing design flexibility due to the need to maintain a minimum distance between substrate layers to avoid increased stray capacitance and inductance, which restricts the placement of components with varying heights and the direct connection of wiring patterns to external terminals.
Innovation Solution
The multilayer electronic device incorporates a non-superposing region between substrate layers, allowing for a designing-required space without increasing the distance between layers, enabling direct connections and high-density component mounting, and using interlayer columnar conductors for shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the distance between substrate layers is decreased to reduce device thickness, then the device thickness is reduced, but stray capacitance between ground electrode and semiconductor element or wiring pattern is increased
Solution Approach 1:
The patent extracts the ground electrode from the upper substrate layer and relocates it to the lower substrate layer, separating the ground electrode from components that generate stray capacitance. This allows the substrate layers to be positioned closer together without increasing stray capacitance, thereby reducing device thickness while maintaining electrical performance.
Solution Approach 2:
The patent changes the vertical arrangement of electrical components by moving the ground electrode to a different layer position (from upper to lower substrate layer). This dimensional reorganization eliminates the stray capacitance issue that would otherwise constrain the vertical spacing between substrate layers, enabling reduced device thickness.
2Reliability
If wiring patterns on topmost substrate are connected to external terminals on bottommost substrate using multiple interlayer connections, then electrical connection is achieved, but stray inductance is increased
Solution Approach 1:
The patent extracts the ground electrode from intermediate substrate layers and consolidates it to the bottommost substrate layer where external terminals are located. This allows direct vertical connection of signal traces from the topmost substrate to external terminals without requiring multiple interlayer ground transitions, thereby reducing stray inductance while maintaining reliable electrical connection.
3Length of stationary object
If substrate layers are positioned close together to reduce device thickness, then device thickness is reduced, but design flexibility for accommodating components of varying heights is limited
Solution Approach 1:
By extracting the ground electrode from the upper substrate layer and relocating it to the lower substrate layer, the patent removes the constraint that previously required sufficient vertical spacing between substrate layers. This enables the substrate layers to be positioned closer together while still accommodating components of varying heights, thus reducing device thickness without sacrificing design flexibility.
Data Source
AI summary
The present disclosure enhances the design flexibility of a multilayer electronic device. A multilayer electronic device is formed by alternately stacking, in a top-bottom direction, substrate layers in which substrates are disposed and a component layer in which at least one component is disposed. A non-superposing region in which a substrate of a first substrate layer positioned on the upper side of a first component layer is not superposed on a substrate of a second substrate layer positioned on the lower side of the first component layer, as viewed from above, is formed in the substrate. Accordingly, within the multilayer electronic device, a space in which the substrate of the second substrate layer is not located can be formed in a region under the non-superposing region of the substrate of the first substrate layer. By using this space, the design flexibility of the multilayer electronic device can be enhanced.