Electronic Component Mounting System Solder Correction
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Solution Overview
Problem
Existing electronic component mounting systems face challenges in combining the correction of solder position misalignment with the additional application of solder to ensure adequate amounts, leading to inefficiencies in productivity and quality.
Innovation Solution
An electronic component mounting system that integrates screen printing, solder position detection, solder amount inspection, and mounting position correction, allowing for automatic additional solder application at predetermined positions, independent of the actual solder position, ensuring accurate mounting without position correction for components on electrodes with insufficient solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mounting position correction is performed based on solder print position, then mounting accuracy is improved, but productivity deteriorates due to additional inspection and correction steps
Solution Approach 1:
The system performs preliminary solder application to positions determined to have insufficient solder before the electronic component mounting process. By pre-positioning the solder at the correct location, the system eliminates the need for post-inspection correction steps, thereby maintaining high mounting accuracy while improving productivity.
Solution Approach 2:
The system uses inspection results from the solder print inspection apparatus to provide feedback on solder amount and position. This feedback is used to automatically determine which electrodes require additional solder application, enabling precise correction only where needed rather than universal correction, thus balancing accuracy and productivity.
2Quantity of substance
If additional solder is applied to electrodes with insufficient solder, then solder amount is improved, but device complexity increases due to integration of inspection and correction systems
Solution Approach 1:
The system merges the solder print inspection apparatus and the solder application means into an integrated electronic component mounting system. The inspection results directly control the solder application process, combining multiple functions (inspection, determination, and correction) into a unified system that manages complexity through functional integration rather than separate independent systems.
Solution Approach 2:
The system performs self-correction by automatically applying additional solder to electrodes identified as having insufficient solder. The inspection apparatus identifies the problem, and the same system automatically corrects it without requiring external intervention or complex manual correction processes, thereby managing complexity through automated self-service.
3Manufacturing precision
If solder application is performed at actual solder position, then solder precision is improved, but productivity deteriorates due to position-based correction requirements
Solution Approach 1:
The system applies different treatments to different electrodes based on local conditions. For electrodes with sufficient solder, no correction is made. For electrodes with insufficient solder, additional solder is applied at the predetermined electrode position rather than the actual solder position. This local differentiation maintains precision where needed while improving overall productivity.
Solution Approach 2:
The system performs preliminary determination of which electrodes require additional solder based on inspection results before the mounting process. By pre-identifying and pre-applying solder to affected electrodes, the system eliminates the need for time-consuming position-based corrections during or after mounting, thereby improving productivity while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system achieves high-quality packaging by correcting solder position misalignment and automatically applying solder, enhancing productivity and labor efficiency while maintaining accurate solder bonding.
Implementation Method 1
screen printing means that prints solder on an electrode of a circuit substrate by screen printing
Implementation Method 2
the electronic component is attracted to the electrode and correctly aligned due to the self-alignment effect of molten solder
Implementation Method 3
reflow apparatus which heats the substrate after the electronic component mounting, thereby solder-bonding the electronic component to the substrate
Implementation Method 4
solder-bonding the electronic component to the substrate
Data Source
AI summary
In a case where a solder amount of a solder portion printed on an electrode does not meet a reference amount, solder is additionally applied to a center position of the electrode by a control section. With respect to a component mounting position to which the solder is not additionally applied, correction from a component mounting position of a substrate to a corrected mounting position is performed and an electronic component is mounted at the corrected mounting position. The electronic component corresponding to another component mounting position with the solder additionally applied thereto is mounted at the design component mounting position in the positioned substrate.